A thin film network comprising a component with at least a first and a second current supply contact (7) and with a carrier substrate (1), at least a first structured electrically conducting layer (2) superimposed upon, and contacting, said substrate, at least a first structured dielectric (3) super imposed upon, and contacting, said at least first structured electrically conducting layer (2), and at least a second structured electrically conductive layer (5) superimposed upon said at least first structured dielectric (3), characterized in that the current supply contact (7)is an electroplated SMD end contact, a bump end contact or a contact surface.