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AssigneeKaneka Corporation
InventorsKazushige Tamura, Fusamori Araki, Seiichi Nagamine
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A self-bonding insulated wire having a bonding layer on an insulated wire, the bonding layer including a crystalline copolyamide having a melting point within the range of 105 to 150° C. and a relative viscosity of 1.4 to 1.6 measured at 25° C. with respect to a 0.5% by weight m-cresol solution thereof, and optionally at least one member selected from the group of a high-melting nylon having a melting point within the range of 200 to 300° C. and an antioxidant. The bonding layer can be formed from a coating having an increased resin concentration and the residual solvent content of the bonding layer is small. The self-bonding insulated wire and self-bonding litz wire composed thereof provide deflecting coils having a decreased strain, good adhesive property and good heat resistance.
A self-bonding insulated wire having a bonding layer on an insulated wire, wherein said bonding layer is formed by applying and baking a coating comprising a crystalline copolyamide having a melting point within the range of 105 to 150° C. and a relative viscosity of 1.4 to 1.6 measured at 25° C. with respect to a 0.5% by weight m-cresol solution thereof, and the relative viscosity of a 0.5% by weight solution of said formed bonding layer dissolved in m-cresol is from 1.4 to 1.6 at 25° C.
A self-bonding insulated wire having a bonding layer on an insulated wire, said bonding layer comprising a crystalline copolyamide having a melting point within the range of 105 to 150° C. and a relative viscosity of 1.4 to 1.6 measured at 25° C. with respect to a 0.5% by weight m-cresol solution thereof, and at least one member selected from the group consisting of a high-melting nylon having a melting point within the range of 200 to 300° C. and an antioxidant.
A self-bonding insulated wire having a bonding layer on an insulated wire, wherein said bonding layer comprises a crystalline copolyamide having a melting point within the range of 105 to 150° C. and the relative viscosity of a 0.5% by weight solution prepared by dissolving said bonding layer in m-cresol is from 1.4 to 1.6 at 25° C.
Dependencies are inferred from the claim text.