Modeling lightweight dough
AssigneePadico Co., Ltd.
InventorNoritada Yuyama
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Abstract
The invention provides modeling lightweight dough comprising synthetic resin hollow microspheres having a particle diameter of 20 to 120 μm, polyvinyl alcohol, vinyl acetate resin, and water. The dough of the present invention is excellent in lightweight, formability, shape preservation of the modeled shape, and bending deformation resistance of the modeled product obtained by modeling and drying. The modeled product is long lasting.
Claims12
Modeling lightweight dough comprising synthetic resin hollow microspheres having a particle diameter of 20 to 120 μm, polyvinyl alcohol, vinyl acetate resin, polyethylene oxide, and water.
Modeling lightweight dough comprising synthetic resin hollow microspheres having a particle diameter of 20 to 120 μm, polyvinyl alcohol, vinyl acetate resin containing plasticizer, polyethylene oxide, and water.
Modeling lightweight dough comprising 5 to 15% by weight of synthetic resin hollow microspheres having a particle diameter of 20 to 120 μm, 5 to 10% by weight of polyvinyl alcohol, 1.5 to 6% by weight of vinyl acetate resin containing plasticizer, 0.5 to 1.5% by weight of polyethylene oxide, and 50 to 80% by weight of water.
Modeling lightweight dough comprising a mixture of an aqueous dispersion containing synthetic resin hollow microspheres having a particle diameter of 20 to 120 μm, polyvinyl alcohol, vinyl acetate resin aqueous emulsion, polyethylene oxide, and water.
Dependencies are inferred from the claim text.