Method and apparatus for extending fatigue life of solder joints in a semiconductor device

A method for making a device, the method comprising the steps of:

• providing a device containing electrical circuitry, the device having a first plurality of conductive contact regions having a first surface area, and the device having a second plurality of conductive contact regions having a second surface area, wherein the second surface area is substantially larger than the first surface area;
• attaching a first plurality of solder balls to the first plurality of conductive contact regions, each of the first plurality of solder balls having a volume X;
• attaching a second plurality of solder balls to the second plurality of conductive contact regions, each of the second plurality of solder balls having a volume Y that is substantially greater than the volume X;
• reflowing the first and second plurality of solder balls on the first and second plurality of conductive contact regions to provide a first plurality of reflowed solder balls and a second plurality of reflowed solder balls;
• wherein a standoff height of the first and second reflowed solder balls are substantially equal before being connected to another surface.