Process for making fine pitch connections between devices and structure made by the process

A method for fabricating a semiconductor device including a chip, comprising the steps of:

• providing a plate transparent to ablating radiation;
• forming a first layer on the plate;
• providing a stud on a first surface of the first layer opposite the plate, where the plate, the first layer and the stud form an alignment structure;
• forming a second layer on a first surface of the chip including a conducting pad contacting the chip;
• forming a via in the second layer to expose the conducting pad;
• aligning the stud to the via;
• attaching the chip to the alignment structure, so that the first layer contacts the second layer and the stud makes electrical contact with the conducting pad;
• attaching a support to the chip;
• and
• ablating an interface between the first layer and the plate using ablating radiation transmitted through the plate, thereby detaching the plate.

A method for fabricating a semiconductor device including a chip, comprising the steps of:

• forming an alignment structure including a plate transparent to ablating radiation and a first layer disposed on the plate;
• forming a stud on one of the chip and the first layer and a second layer on the other of the chip and the first layer;
• forming a via in the second layer;
• aligning the stud to the via;
• attaching the chip to the alignment structure;
• attaching a support to the chip;
• and
• ablating an interface between the first layer and the plate using ablating radiation transmitted through the plate, thereby detaching the plate.