Semiconductor sensor device and method of manufacturing the same

A method of manufacturing a semiconductor dynamic sensor chip having movable electrodes responsive to dynamic force imposed thereon and stationary electrodes facing the movable electrodes, a capacitance formed between the movable electrodes and stationary electrodes being changed in response to the dynamic force, the method comprising:

• forming a plurality of semiconductor dynamic sensor chips, peripheral ditches surrounding each sensor chip and peripheral banks further surrounding each ditch on a first surface of a semiconductor substrate;
• electrically connecting the peripheral bank to an inner portion of each sensor chip to prevent formation of parasitic capacitance therebetween;
• pasting a protecting sheet on the first surface of the semiconductor substrate;
• and
• dicing the semiconductor substrate from a second surface of the semiconductor substrate along the peripheral banks, thereby separating the plurality of sensor chips into individual pieces.