Semiconductor devices and methods for same
AssigneeThe Board of Trustees of the University of Illinois
InventorsJoseph W. Lyding, Karl Hess
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Abstract
Described are preferred processes for conditioning semiconductor devices with deuterium to improve operating characteristics and decrease depassivation which occurs during the course of device operation. Also described are semiconductor devices which can be prepared by such processes.
Claims8
A process for treating a semiconductor device including a semiconductor region and an insulating layer having an interface with the semiconductor region and a contact on said insulating layer overlying said interface, comprising the steps of forming said insulating layer with a thickness not exceeding about 55 Angstroms beneath said contact, and of annealing said semiconductor device, subsequent to completion of fabrication of said device, in an ambient including deuterium to form a concentration of deuterium at the interface between said semiconductor region and said insulating layer region effective to substantially reduce degradation of said device associated with hot carrier stress.
A process for treating an insulated gate field effect transistor device structure including a channel region extending between source and drain regions, a gate insulating layer having an interface with said channel region, and contacts to said source and drain regions and on said gate insulator layer, comprising forming said gate insulator beneath the gate contact to have a thickness not greater than about 55 Angstroms and, subsequent to formation of said source, drain and gate contacts, annealing the device in an ambient including deuterium at a temperature above about 200° C. and below a decomposition or melting temperature of said structure to form a concentration of deuterium at said interface region effective to substantially reduce degradation of said device associated with hot carrier stress by increasing a practical lifetime at least about 10 times that provided by a corresponding passivation with hydrogen, where practical lifetime is taken as 20% transconductance degradation as a result of electrical stress.
Dependencies are inferred from the claim text.