Method of making semiconductor package with heat spreader

A method of making a semiconductor package with a heat spreader, comprising the steps of:

• preparing a matrix-type chip carrier module plate consisting of a plurality of array-arranged chip carriers, wherein each of the chip carriers has an upper surface and a lower surface;
• mounting at least one chip at a predetermined position on the upper surface of each of the chip carriers, allowing the chip to be electrically connected to the chip carrier;
• depositing at least one buffer pad on each of the chips, wherein the buffer pad is made of a material similar in coefficient of thermal expansion to the chip;
• providing a heat spreader module plate having an upper surface, and a lower surface attached to the chips mounted on the chip carriers so as to interpose the chips between the chip carrier module plate and the heat spreader module plate, and forming an interface layer on the upper surface of the heat spreader module plate, wherein adhesion force between the interface layer and a molding compound used for forming an encapsulant is larger than that between the interface layer and the heat spreader module plate, as well as adhesion force between the interface layer and the heat spreader module plate is smaller than that between the heat spreader module plate and the molding compound;
• forming the encapsulant by using the molding compound for encapsulating the heat spreader module plate and the chips;
• performing a singulation process to form individual semi-fabricated semiconductor packages;
• and
• removing residues of the molding compound formed on the interface layer of each of the simi-fabricated semiconductor packages so as to form the semiconductor package.