Back to results
US 6,444,497 B1Granted
Method and apparatus for reducing BGA warpage caused by encapsulation
AssigneeMicron Technology, Inc.
InventorsRichard Wensel, Scott Gooch
Life of this patent
Estimating the term…
Abstract
The present invention provides a ball grid array (“BGA”) assembly and process of manufacturing for reducing warpage caused by the encapsulation of the associated semiconductor chip. The assembly and process includes coupling a substrate between a semiconductor chip and a BGA structure; attaching a stabilizing plate to the substrate adjacent the BGA structure; and encapsulating the semiconductor chip.
Claims17
A process of fabricating a semiconductor device assembly, comprising:
- providing a substrate including first and second surfaces;
- securing a semiconductor chip to the first surface of the substrate;
- coupling a ball grid array (“BGA”) structure to the substrate on the second surface;
- attaching a stabilizing plate to the substrate adjacent the BGA structure;
- and
- encapsulating the chip and a portion of the substrate adjacent the chip with an encapsulant;
- wherein attaching the stabilizing plate comprises attaching a stabilizing plate providing a strength greater than the strength of the protective layer;
- and wherein said stabilizing plate has a co-efficient of thermal expansion greater than the coefficient of thermal expansion of the encapsulant.
5 more elements
A process of fabricating a semiconductor device assembly, comprising:
- providing a substrate;
- attaching a ball grid array (“BGA”) structure to a first surface of the substrate;
- mounting a semiconductor chip to a second surface of the substrate;
- reinforcing the periphery of the BGA structure;
- and
- applying a protective layer to and over the chip and a portion of the substrate adjacent the chip;
- wherein reinforcing the periphery of the BGA structure comprises coupling a rigid plate providing a strength greater than the strength of the protective layer;
- and
- wherein said rigid plate has a co-efficient of thermal expansion greater than the co-efficient of thermal expansion of the protective layer.
6 more elements
Dependencies are inferred from the claim text.