Semiconductor device mounting jig and method of mounting semiconductor device

A method to mount a semiconductor device to a flexible tape substrate using a semiconductor device mounting jig, the method comprising:

• presenting the semiconductor device mounting jig, wherein the semiconductor device mounting jig comprises a suction plate having a flat surface and a plurality of suction holes penetrated through the suction plate, wherein the plurality of suction holes are disposed in a suction pattern such that none of the suction holes are configured to have an area in common with any of the land electrodes, a plate support having a plate support body, wherein the plate support body defines an opening that leads to a hollow portion and wherein the suction plate is disposed in the opening of the plate support, and a suction nozzle coupled to the plate support and configured to provide a vacuum to the hollow portion, wherein the suction nozzle comprises a valve;
• placing the flexible tape substrate on the suction plate so as to cover the suction pattern;
• drawing a vacuum in the hollow portion so as to hold the flexible tape substrate to the suction plate;
• turning the valve to seal the hollow portion;
• aligning a plurality of solder ball bumps of the semiconductor device onto the plurality of land electrodes to form a gap between the semiconductor device and the flexible tape substrate;
• injecting resin into the gap at atmospheric pressure while maintaining the vacuum in the hollow portion;
• curing the resin at atmospheric pressure to seal solder ball bumps of the semiconductor device while maintaining the vacuum in the hollow portion;
• and
• releasing the vacuum from the hollow portion.