US 6,444,296 B1 · CONSTITUENT SUBSTRATE FOR ELECTRONIC EQUIPMENT USING WIRING LAYER MADE OF COPPER AND TRANSPARENT CONDUCTIVE LAYER MADE OF COMPOSITE OXIDE CONTAINING INDIUM OXIDE AND METAL OXIDE AS MAIN COMPONENTS AND ELECTRONIC EQUIPMENT USING THE SAME

Abstract

The present invention provides a constituent substrate for electronic equipment using a wiring layer made of a material which causes no increase in electric resistance value in a contact portion even in direct contact with a transparent conductive layer made of ITO or the like. The constituent substrate for electronic equipment of the present invention uses a wiring layer made of copper, and a transparent conductive layer made of a composite oxide containing indium oxide and an oxide of at least one metal selected from the group consisting of zinc, tin, gallium, thallium, magnesium, and lead as main components.

Claims7

Dependent claims

A constituent substrate for electronic equipment comprising a wiring layer made of copper, and a transparent conductive layer including a composite oxide comprising indium oxide and an oxide of at least one metal selected from the group consisting of zinc, tin, gallium, thallium, magnesium and lead as main components on and in contact with the copper wiring layer, and wherein the wiring layer and the transparent conductive layer are disposed on a substrate layer.

Dependencies are inferred from the claim text.

Facts

Application

09/385,184Filed 30 Aug 1999

Priority

JP 10-24633731 Aug 1998

Published

US 2002/0061410 A123 May 2002

Granted

3 Sep 2002

Term ends

Not estimatedThe source records don’t support an estimate.

Classification13 codes

H10D 30/0316
Characterised by the gate electrodes: of lateral bottom-gate TFTs comprising only a single gate
G02F 1/13458
Conductors connecting electrodes to cell terminals: terminal pads
G02F 1/136286
Active matrix addressed cells: wiring, e.g. gate line, drain line
H10D 30/0321
Of thin-film transistors [TFT]: comprising silicon, e.g. amorphous silicon or polysilicon

Constituent substrate for electronic equipment using wiring layer made of copper and transparent conductive layer made of composite oxide containing indium oxide and metal oxide as main components and electronic equipment using the same

Life of this patent

Constituent substrate for electronic equipment using wiring layer made of copper and transparent conductive layer made of composite oxide containing indium oxide and metal oxide as main components and electronic equipment using the same

Life of this patent

Abstract

Claims7