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US 6,444,157 B1Granted
Method of resin molding
AssigneeApic Yamada Corporation
InventorFumio Miyajima
Life of this patent
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Abstract
A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of molding dies. A member to be molded by the molding dies 15 is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.
Claims11
A method of molding a semiconductor with thermosetting resin comprising the steps of:
- covering a parting face of a pair of molding dies including a cavity, a cull and a pot with a sheet of release film, said release film being easily peelable from said molding dies and thermosetting resin;
- sucking said release film to hold said release film on said parting face;
- further sucking said release film to stick the release film on and along an inner face of the cavity;
- forming said release film with an accommodating section to correspond to an inner shape of the pot;
- supplying a thermosetting resin tablet to the accommodating section in the pot;
- and
- clamping the semiconductor to be molded between said molding dies to mold.
4 more elements
A method of resin molding comprising the steps of:
- fixing a sheet of release film capable of easily peeling off from the molding dies and resin on inner faces of molding sections including cavities, a cull and a pot, by means of an air sucking mechanism provided exteriorly of the molding dies and in communication with an air path formed between an inner face of the pot and an outer face of a plunger in the pot;
- sucking said release film onto the inner faces of the molding sections;
- providing a resin tablet onto said release film at a position corresponding to the pot;
- setting the resin tablet in the pot by closing said molding dies;
- supplying resin melt to the cavities of the molding dies from the pot;
- attaching a seal ring on an outer circumferential face of the plunger on a base side thereof;
- and
- sealing the air path at a midway position of the plunger with the seal ring.
5 more elements
Dependencies are inferred from the claim text.