In-line compounding/extrusion deposition and molding apparatus and method of using the same
AssigneeDelphi Technologies, Inc.
InventorsSuresh Deepchand Shah, Jason Alan Waite
Life of this patent
Estimating the term…
Loading patent…
AssigneeDelphi Technologies, Inc.
InventorsSuresh Deepchand Shah, Jason Alan Waite
Estimating the term…
According to the present invention an in-line compounding/extrusion deposition and molding apparatus and method of using the same are provided. The apparatus comprises a single step compounding and extrusion apparatus which includes an extruder screw. The apparatus includes a first zone, a second zone, and a third zone. The first zone is used to melt an inlet material before the screw advances the melted inlet material into the second zone which comprises a preparation and cutting zone. Simultaneously, as the inlet material is melted in the first zone, the screw rotation feeds a reinforcing fiber bundle into the second zone where the reinforcing fiber bundle is prepared for melt impregnation and is sheared to a desired length. While in the second zone, mixing begins between the melted inlet material and the sheared reinforcing fiber bundle. Next the mixture is advanced into the third zone for uniform distributive mixing and impregnation of the sheared reinforcing fiber bundle with the melted inlet material to form a fiber bundle filled melt. The apparatus includes at least one winding/unwinding reel which continuously ensures that the reinforcing fiber bundle is under constant tension (no sagging or breaking thereof) during the X, Y, Z movement of the apparatus during melt deposition as well as during forward movement of the screw within the barrel.
A process for in-line compounding of a reinforcing fiber bundle with extrusion compression molding using an in-line compounding/extrusion deposition and molding apparatus, the process comprising:
A process for in-line manufacturing of a fiber reinforced molded structure, the process comprising:
Dependencies are inferred from the claim text.