High toughness plate alloy for aerospace applications
AssigneeAlcoa Inc.
InventorsJohn Liu, Robert W. Westerlund, Gary H. Bray, Terrence N. Thom, Dhruba J. Chakrabarti
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Abstract
The present invention is directed to highly controlled alloy composition relationship of a high purity Al—Mg—Cu alloy within the 2000 series aluminum alloys as defined by the Aluminum Association, wherein significant improvements are revealed in fracture toughness through plane strain, fracture toughness through plane stress, fatigue life, and fatigue crack growth resistance.
Claims40
A 2000 series aluminum plate alloy consisting essentially of in weight percent about 3.60 to 4.25 copper, about 1.00 to 1.60 magnesium, about 0.30 to 0.80 manganese, no greater than about 0.05 silicon, no greater than about 0.07 iron, no greater than about 0.06 titanium, no greater than about 0.002 beryllium, the remainder aluminum and incidental elements and impurities, wherein a Tmax heat treatment is below the lowest incipient melting temperature for a given 2000 series alloy composition and the Cutarget is determined by the expression:
- Cutarget=Cueff+0.74(Mn−0.2)+2.28(Fe−0.005)
- wherein said alloy improves by a minimum of 5% compared to the average values of standard 2324-T39 alloy shown in FIG. 1 for the same properties selected from the group consisting of the plane strain fracture toughness, KIc, the plane stress fracture toughness, Kapp, the stress intensity factor range, ΔK, at a fatigue crack growth rate of 10 μ-inch/cycle wherein R=0.1 and RH is greater than 90%, and combinations thereof.
A 2000 series aluminum plate alloy consisting essentially of a composition within the box of W, X, Y, and Z as defined in FIG. 5, wherein Tmax for each composition corner point is W=925° F., X=933° F., Y=917° F., and Z=909° F., wherein Cutarget is defined by the following equation:
- Cutarget=Cueff+0.74(Mn−0.2)+2.28(Fe−0.005).
Dependencies are inferred from the claim text.