Method of cleaning a semiconductor substrate
AssigneeKabushiki Kaisha Toshiba
InventorKunihiro Miyazaki
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Abstract
A method of cleaning a semiconductor substrate is disclosed. The method comprises setting a substrate to-be-treated substantially in parallel to ends of multi-nozzles including an inner tube nozzle and an outer tube nozzle to oppose each other, cleaning the substrate by discharging, to the substrate, a chemical fluid, a combination of chemical fluid and a gas, pure water, or a combination of pure water and a gas through the outer tube nozzle and simultaneously discharging a chemical fluid, a combination of a chemical fluid and a gas, pure water, or a combination of pure water and a gas through the inner tube nozzle, and washing the substrate by discharging pure water to the substrate through at least one of the inner tube nozzle and the outer tube nozzle.
Claims6
A method of cleaning a substrate comprising:
- setting a substrate to-be-treated substantially in parallel to ends of multi-nozzles including an inner tube nozzle and an outer tube nozzle to oppose each other;
- cleaning the substrate by discharging, to the substrate, a chemical fluid, a combination of a chemical fluid and a gas, pure water, or a combination of pure water and a gas through the outer tube nozzle and simultaneously discharging a chemical fluid, a combination of a chemical fluid and a gas, pure water, or a combination of pure water and a gas through the inner tube nozzle;
- and
- washing the substrate by discharging pure water to the substrate through at least one of the inner tube nozzle and the outer tube nozzle.
Dependencies are inferred from the claim text.