Polishing head of a chemical mechanical polishing apparatus and, retainer ring of the same

A polishing head of a chemical mechanical polishing (CMP) apparatus, the polishing head comprising:

• a vacuum line;
• a membrane support plate disposed at a bottom of the polishing head, said membrane support plate having a plurality of pores communicating with said vacuum line;
• a membrane pad fixed to a bottom of the membrane support plate;
• a flexible membrane extending over a bottom of said membrane pad and an outer peripheral surface of said membrane support plate;
• a membrane clamp fixing said flexible membrane to said membrane support plate;
• and
• a retainer ring fixed in place at a bottom peripheral portion of the polishing head,
• said retainer ring comprising an annular ring body having a radially innermost peripheral surface spaced from said flexible membrane at the outer peripheral surface of said membrane support plate such that a gap is defined between the retainer ring and the flexible membrane, the gap terminating at a space within the polishing head adjacent the radially innermost surface of the ring body, a radially outermost peripheral surface, and at least six contaminant outlets extending between and open to said radially innermost and radially outermost peripheral surfaces of the ring body for exhausting contaminants induced into said space within the polishing head,
• said contaminant outlets being spaced apart from one another in a circumferential direction of the ring body at substantially equal angular intervals, and a sum of widths of the contaminant outlets as taken at said radially innermost peripheral surface in the circumferential direction thereof being at least 30% of a circumference of said radially innermost peripheral surface, and
• said ring body having a top surface, and a plurality of threaded holes extending into said top surface and screws extending into said threaded holes to thereby fix the retainer ring in place in the polishing head, the contaminant outlets being offset from the threaded holes in the circumferential direction of the ring body.

A polishing head of a chemical mechanical polishing (CMP) apparatus, the polishing head comprising:

• a vacuum line;
• a membrane support plate disposed at a bottom of the polishing head, said membrane support plate having a plurality of pores communicating with said vacuum line;
• a membrane pad fixed to a bottom of the membrane support plate;
• a flexible membrane extending over a bottom of said membrane pad and an outer peripheral surface of said membrane support plate;
• a membrane clamp fixing said flexible membrane to said membrane support plate;
• and
• a retainer ring fixed in place at a bottom peripheral portion of the polishing head,
• said retainer ring comprising an annular ring body having a radially innermost peripheral surface spaced from said flexible membrane at the outer peripheral surface of said membrane support plate such that a gap is defined between the retainer ring and the flexible membrane, the gap terminating at a space within the polishing head adjacent the radially innermost surface of the ring body, a radially outermost peripheral surface, and at least six contaminant outlets extending between and open to said radially innermost and radially outermost peripheral surfaces of the ring body for exhausting contaminants induced into said space within the polishing head,
• said contaminant outlets being spaced apart from one another in a circumferential direction of the ring body at substantially equal angular intervals, and a sum of widths of the contaminant outlets as taken at said radially innermost peripheral surface in the circumferential direction thereof being at least 30% of a circumference of said radially innermost peripheral surface, and
• said contaminant outlets defining inner openings at said radially innermost peripheral surface, and outer openings at said radially outermost peripheral surface, each of said inner and outer openings being in a form of a slot elongate in the circumferential direction of the ring body.

A polishing head of a chemical mechanical polishing (CMP) apparatus, the polishing head comprising:

• a vacuum line;
• a membrane support plate disposed at a bottom of the polishing head, said membrane support plate having a plurality of pores communicating with said vacuum line;
• a membrane pad fixed to a bottom of the membrane support plate;
• a flexible membrane extending over a bottom of said membrane pad and an outer peripheral surface of said membrane support plate;
• a membrane clamp fixing said flexible membrane to said membrane support plate;
• and
• a retainer ring fixed in place at a bottom peripheral portion of the polishing head,
• said retainer ring comprising an annular ring body having a radially innermost peripheral surface spaced from said flexible membrane at the outer peripheral surface of said membrane support plate such that a gap is defined between the retainer ring and the flexible membrane, the gap terminating at a space within the polishing head adjacent the radially innermost surface of the ring body, a radially outermost peripheral surface, and at least six contaminant outlets extending between and open to said radially innermost and radially outermost peripheral surfaces of the ring body for exhausting contaminants induced into said space within the polishing head,
• said contaminant outlets being spaced apart from one another in a circumferential direction of the ring body at substantially equal angular intervals, and a sum of widths of the contaminant outlets as taken at said radially innermost peripheral surface in the circumferential direction thereof being at least 30% of a circumference of said radially innermost peripheral surface, and
• each of said contaminant outlets consisting of a plurality of inner holes spaced apart from one another in the circumferential direction of the ring body and extending from said radially innermost peripheral surface thereof, and a single outer hole to which said plurality of inner holes open into, said outer hole extending from said inner holes to said radially outermost peripheral surface of the ring body.

A polishing head of a chemical mechanical polishing (CMP) apparatus, the polishing head comprising:

• a vacuum line;
• a membrane support plate disposed at a bottom of the polishing head, said membrane support plate having a plurality of pores communicating with said vacuum line;
• a membrane pad fixed to a bottom of the membrane support plate;
• a flexible membrane extending over a bottom of said membrane pad and an outer peripheral surface of said membrane support plate;
• a membrane clamp fixing said flexible membrane to said membrane support plate;
• and
• a retainer ring fixed in place at a bottom peripheral portion of the polishing head,
• said retainer ring comprising an annular ring body having a radially innermost peripheral surface spaced from said flexible membrane at the outer peripheral surface of said membrane support plate such that a gap is defined between the retainer ring and the flexible membrane, the gap terminating at a space within the polishing head adjacent the radially innermost surface of the ring body, a radially outermost peripheral surface, and at least six contaminant outlets extending between and open to said radially innermost and radially outermost peripheral surfaces of the ring body for exhausting contaminants induced into said space within the polishing head,
• said contaminant outlets being spaced apart from one another in a circumferential direction of the ring body at substantially equal angular intervals, and a sum of widths of the contaminant outlets as taken at said radially innermost peripheral surface in the circumferential direction thereof being at least 30% of a circumference of said radially innermost peripheral surface, and
• each of said contaminant outlets extending longitudinally from said radially innermost peripheral surface of said ring body to said radially outermost peripheral surface of said ring body at an angle with respect to a line extending in a radial direction of the ring body through a center of an inner opening of the corresponding contaminant outlet at the radially innermost peripheral surface of the ring body.