Method of finishing a silicon part

A method of finishing a silicon part using (1) a rotatable grinding wheel having diamond particles and a bonding agent, and (2) a plurality of grit materials, the method comprising:

• (a) dressing the rotatable grinding wheel to form a wheel with a grinding surface having a plurality of diamond particles forming a substantially uniform diamond particle grinding diameter;
• (b) thereafter removing bonding material from the grinding wheel surface and from between the plurality of diamond particles without significant removal of the plurality of diamond particles;
• (c) thereafter applying an enhanced lubricity material to the grinding wheel;
• (d) thereafter grinding a surface of the silicon part with the rotatable grinding wheel while cooling the silicon part with a plurality of cooling lines;
• and
• (e) thereafter finishing the ground surface of the silicon part with the plurality of grit materials having substantially different grit sizes.

A method of finishing a silicon part using (1) a rotatable grinding wheel having diamond particles and a bonding agent, and (2) one or more grit materials, the method comprising:

• (a) dressing the rotatable grinding wheel to form a wheel with a grinding surface having a plurality of diamond particles forming a substantially uniform diamond particle grinding diameter;
• (b) thereafter removing bonding material from the grinding wheel surface and from between the plurality of diamond particles without significant removal of the plurality of diamond particles;
• (c) thereafter applying an enhanced lubricity material to the grinding wheel;
• (d) thereafter grinding a surface of the silicon part with the rotatable grinding wheel while cooling the silicon part with a plurality of cooling lines;
• and
• (e) thereafter finishing the ground surface of the silicon part with the one or more grit materials while cooling the silicon part with a plurality of cooling lines.