Apparatus for filling a gap between spaced layers of a semiconductor
AssigneeMicron Technology, Inc.
InventorJ. Michael Brand
Life of this patent
Estimating the term…
Abstract
A semiconductor device assembly with a gap to be filled has thermal vias formed in the supporting substrate. After the semiconductor device is connected to the substrate and fill material positioned about the gap to create a seal, a vacuum is drawn through the thermal vias and a pressure applied to the fill material to urge the fill material into the interior of the gap.
Claims12
Apparatus for filling a gap between a semiconductor device and a substrate of a semiconductor device assembly, said apparatus comprising:
- a supporting structure used to support a semiconductor device assembly;
- said semiconductor device assembly comprising:
- a substrate and a semiconductor device attached thereto, a perimeter extending around all sides of said semiconductor device, a gap between said semiconductor device and said substrate, said semiconductor device having an active surface facing said gap and an exterior surface, and said substrate having a plurality of electrical circuits facing said gap and an exterior surface with a plurality of thermal vias formed between said plurality of electrical circuits and said exterior surface with said thermal vias in communication with said gap;
- a fill apparatus for positioning fill material about said perimeter of said gap, said fill apparatus having a source of fill material;
- a pressure chamber positioned about said external surface of said semiconductor device applying a desired fluid pressure against said fill material positioned about said perimeter with said desired fluid pressure against said fill material;
- and
- a vacuum chamber positioned about said exterior surface of said substrate, said vacuum chamber being configured to draw a vacuum through said plurality of thermal vias.
Apparatus for filling a gap between a semiconductor device and a substrate of a semiconductor device assembly, said apparatus comprising:
- a supporting structure used to support a semiconductor device assembly;
- a semiconductor device assembly comprising:
- a substrate and a semiconductor device attached thereto, a perimeter extending around all sides of the semiconductor device, a gap between the semiconductor device and the substrate, said semiconductor device having an active surface facing said gap and an exterior surface, and said substrate having a plurality of electrical circuits facing said gap and an exterior surface with a plurality of thermal vias formed between said plurality of electrical circuits and said exterior surface with said thermal vias in communication with the gap;
- a fill apparatus for positioning fill material about the perimeter of said gap, said fill apparatus containing fill material therein;
- a pressure chamber positioned about said external surface of said semiconductor device applying a desired fluid pressure against said fill material positioned about said perimeter with said desired fluid pressure against said fill material;
- and
- a vacuum chamber positioned about said exterior surface of said substrate, said vacuum chamber being configured to draw a vacuum through said plurality of thermal vias.
Dependencies are inferred from the claim text.