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US 6,443,631 B1Granted
Optical module with solder bond
AssigneeAvanti Optics Corporation
InventorsSteven K. Case, Gregory S. Mowry, Timothy A. Skunes
Life of this patent
Estimating the term…
Abstract
An optical module for use in an optical device is provided which includes an optical component. The optical component is bonded to a relative reference mount which can be attached to couple to a fixed reference mount. The bond is formed by solder.
Claims36
An optical module for use in an optical device, comprising:
- an optical component;
- a relative reference mount which supports the optical component, the relative reference mount having a registration feature configured to couple to a registration feature of a fixed reference mount, the registration features configured to provide a coupling at a fixed position relative to the fixed reference mount, the coupling repeatable in six degrees of freedom;
- and
- solder configured to secure the optical component at a fixed position relative to the relative reference mount registration feature whereby the optical component position is fixed in six degrees of freedom at a prealigned position relative to the relative reference mount registration feature.
1 more element
The optical module of claim.1 wherein solder provides an electrical connection to the optical component.
A method of making an optical module comprising:
- obtaining an optical component;
- obtaining a relative reference mount;
- positioning the relative reference mount and the optical component proximate each other with solder therebetween, wherein there is a gap between the solder and at least one of the relative reference mount and the optical component;
- heating the solder to cause the solder to change state and flow into and fill the gap due to a surface tension effect;
- cooling the solder to thereby fix the relative positions of the relative reference mount and the optical component;
- and
- wherein positioning comprises positioning with six degrees of freedom.
4 more elements
A method of making an optical module comprising:
- obtaining an optical component;
- obtaining a relative reference mount;
- positioning the relative reference mount and the optical component proximate each other with solder therebetween, wherein there is a gap between the solder and at least one of the relative reference mount and the optical component;
- heating the solder to cause the solder to change state and. flow into and fill the gap due to a surface tension effect;
- cooling the solder to thereby fix the relative positions of the relative reference mount and the optical component;
- and
- wherein the solder fixes the optical component in six degrees of freedom relative to the relative reference mount.
4 more elements
Dependencies are inferred from the claim text.