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US 6,441,638 B2Granted
Bus system and circuit board
AssigneeHitachi, Ltd.
InventorsHideki Osaka, Shinichi Suzuki, Akira Yamagiwa, Toshiro Takahashi
Life of this patent
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Abstract
A bus system with an improved propagation velocity, comprising main lines, and a plurality of stub lines provided on a one-to-one correspondence with a plurality of modules, and connecting the corresponding modules to the main lines.
Claims9
A bus system for data transfer among a plurality of interface circuits, comprising:
- a ring bus which is formed by two main lines connected together at both opposite ends;
- and which is formed on a mother board;
- a plurality of resistors for terminating said opposite ends respectively;
- a plurality of connectors for connecting daughter boards having said interface circuits;
- and
- a plurality of stub lines for connecting said connectors with said ring bus,
- wherein a plurality of branch points on said ring bus being connected to said stub lines are arranged at the same electrical interval, and said connectors are mounted on the same surface of said mother board.
4 more elements
A bus system for data transfer among a plurality of interface circuits comprising:
- a ring bus which is formed by two main lines connected together at both opposite ends and which is formed on mother board;
- a plurality of connectors for connecting daughter boards having said interface circuits and resistors for terminating said interface curcuit;
- and
- a plurality of stub lines for connecting said connectors with said ring bus,
- wherein a plurality of branch points on said ring bus being connected to said stub lines are arranged at the same electrical interval, and said connectors are mounted on the same surface of said mother board.
2 more elements
Dependencies are inferred from the claim text.