Processor module heatsink mounting guide posts for function test
AssigneeAdvanced Micro Devices, Inc.
InventorsLoh Yeow Kwang, Chen Kah Shan, Koh Hock Chuan, Ke Siong Chew
Life of this patent
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Abstract
A processor test apparatus including a base and a plurality of guide posts attached to the base to retain a processor, wherein at least one of the plurality of guide posts includes a heat sink guide. A heat sink is provided and a heat sink clamp including a guide member is attached to the heat sink. The guide member moves within the heat sink guide to permit relative motion of the heat sink toward and away from a processor retained by the guide posts.
Claims14
A semiconductor die test apparatus comprising, in combination:
- a base;
- a plurality of guide posts attached to the base to receive a semiconductor die module, at least one of the plurality of guide posts including a heat sink guide;
- a heat sink comprising a guide member and a latch;
- and
- a slot bearing an electrical connector disposed between the guide posts,
- wherein the guide member slides within the heat sink guide to permit relative motion of the heat sink toward a semiconductor die module retained by the guide posts prior to a semiconductor die test and away therefrom after completion of a semiconductor die test,
- wherein a semiconductor die module received by the guide posts is electrically connected to an electrical connector during a semiconductor die test, and
- wherein said latch is configured to fixedly attach said heat sink to a semiconductor die module during a semiconductor die test.
A method for testing a semiconductor die module, the method comprising:
- inserting a semiconductor die module to be tested within a test station;
- sliding a heat sink module including at least one of a heat sink and a fan along a guide toward the semiconductor die module to be tested;
- abutting the heat sink module against the semiconductor die module to be tested;
- and
- performing a functional test of the semiconductor die module to be tested.
Dependencies are inferred from the claim text.