Precision aligned and marked structure

A structure comprising:

• a substrate comprising a first surface and a second surface;
• a reference feature on said first surface, wherein said reference feature is a scribe grid, said scribe grid being a silicon oxide layer which has been selectively etched;
• and
• at least one alignment mark on said second surface, said at least one alignment mark having a defined positional relationship to said reference feature.

A structure comprising:

• a substrate comprising a first surface and a second surface;
• a reference feature on said first surface, wherein said reference feature is a scribe grid, said scribe grid comprising a first scribe line extending in a first direction;
• and
• at least one alignment mark on said second surface, said at least one alignment mark having a defined positional relationship to said reference feature.

A structure comprising:

• a substrate comprising a first surface and a second surface;
• a reference feature on said first surface, wherein said reference feature is a fiducial;
• and
• at least one alignment mark on said second surface, said at least one alignment mark having a defined positional relationship to said reference feature.

A structure comprising:

• a substrate comprising a first surface and a second surface;
• a reference feature on said first surface;
• at least one alignment mark on said second surface, said at least one alignment mark having a defined positional relationship to said reference feature;
• and
• a tape, said first surface being attached to said tape.

A structure comprising:

• a substrate comprising a first surface and a second surface, wherein said substrate is a wafer comprising electronic components;
• a reference feature on said first surface;
• and
• at least one alignment mark on said second surface, said at least one alignment mark having a defined positional relationship to said reference feature, wherein said at least one alignment mark comprises a first segment and a second segment, said first segment being parallel to and spaced apart from said second segment.

A structure comprising:

• a substrate comprising a first surface and a second surface;
• a reference feature on said first surface;
• and
• at least one alignment mark shaped as a scribe grid having a plurality of first scribe lines extending in a first direction and a plurality of second scribe lines extending in a second direction perpendicular to said first direction on said second surface, said at least one alignment mark having a defined positional relationship to said reference feature.

A structure comprising:

• a substrate comprising a first surface and a second surface;
• a reference feature on said first surface;
• and
• at least one alignment mark on said second surface, said at least one alignment mark having a defined positional relationship to said reference feature, wherein said at least one alignment mark is ink.

An array of packages comprising:

• a substrate having a first section;
• an electronic component attached to said first section;
• metallizations on a first surface of said first section;
• contacts on said metallizations, wherein bond pads of said electronic component are electrically connected to said contacts by bond wires;
• a layer of encapsulant covering said electronic component, said bond pads, said bond wires, said contacts, and said metallizations;
• a fiducial on a first surface of said array;
• and
• an alignment mark on a second surface of said array, said alignment mark being in said layer of encapsulant.

A structure comprising:

• a substrate comprising a first surface and a second surface, wherein said substrate is a wafer comprising electronic components selected from the group consisting of micromachine chips and image sensor chips;
• a reference feature on said first surface;
• and
• at least one alignment mark on said second surface, said at least one alignment mark having a defined positional relationship to said reference feature.

A structure comprising:

• a substrate comprising a first surface and a second surface, wherein said substrate is a wafer comprising electronic components;
• a reference feature on said first surface;
• and
• at least one alignment mark on said second surface, said at least one alignment mark having a defined positional relationship to said reference feature, wherein said at least one alignment mark comprises a vertical segment and a horizontal segment intersecting said vertical segment, said horizontal segment being perpendicular to said vertical segment.

A structure comprising:

• a substrate comprising a first surface and a second surface, wherein said substrate is a wafer comprising electronic components;
• a reference feature on said first surface;
• and
• at least one alignment mark on said second surface, said at least one alignment mark having a defined positional relationship to said reference feature, wherein said reference feature comprises a first scribe grid on said first surface and wherein said at least one alignment mark comprises a second scribe grid on said second surface.