Bond wire pressure sensor die package

An array of pressure sensor die packages comprising:

• a plurality of pressure sensor dice, said pressure sensor dice each comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface;
• an array substrate, said array substrate comprising an array substrate first surface and an array substrate second surface, opposite said array substrate first surface, said array substrate first surface comprising a plurality of die attach regions, said pressure sensor dice second surfaces being attached to said die attach regions such that no more than one pressure sensor die is attached in each die attach region;
• and
• encapsulant, said encapsulant comprising an outer surface, said encapsulant covering a portion of said array substrate first surface and said pressure sensor dice, said encapsulant comprising a plurality of cavities over said pressure sensor dice first surfaces such that a first region of each of said pressure sensor dice first surfaces is not covered by said encapsulant.

A pressure sensor package comprising:

• pressure sensor means, said pressure sensor means comprising a pressure sensor means first surface and a pressure sensor means second surface, opposite said pressure sensor means first surface;
• a support means, said support means comprising a support means first surface and a support means second surface, opposite said support means first surface, said support means first surface comprising a pressure sensor means attach region;
• means for attaching said pressure sensor means second surface to said support means first surface in said pressure sensor means attach region;
• means for forming a cavity over a first region of said pressure sensor means first surface, said cavity comprising side surfaces and a bottom surface wherein;
• said first region of said pressure sensor means first surface is said bottom surface of said cavity and said first region of said pressure sensor means first surface is exposed at the bottom of said cavity;
• and
• coupling means for covering said first region of said first surface of said pressure sensor means at the bottom of said cavity, said coupling means filling at least a portion of said cavity.

A pressure sensor die package comprising:

• a pressure sensor die, said pressure sensor die comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface;
• a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate first surface comprising a die attach region, said pressure sensor die second surface being attached to said substrate first surface in said die attach region;
• encapsulant, said encapsulant comprising an outer surface, said encapsulant covering a portion of said substrate first surface and said pressure sensor die, said encapsulant comprising a cavity over said pressure sensor die first surface, said cavity in said encapsulant comprising a length and width parallel to said pressure sensor die first surface of approximately 1.0 mm square and a cavity depth perpendicular to said pressure sensor die first surface of approximately at least 0.254 mm, such that a first region of said pressure sensor die first surface is not covered by said encapsulant;
• and
• coupling gel, said coupling gel filling at least a portion of said cavity in said encapsulant such that said coupling gel covers said first region of said pressure sensor die first surface.

A pressure sensor die package comprising:

• a pressure sensor die, said pressure sensor die comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface, said pressure sensor die comprising a differential pressure sensor die with a die hole connecting said second surface of said pressure sensor die to a cavity formed in said pressure sensor die;
• a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate first surface comprising a die attach region, said pressure sensor die second surface being attached to said substrate first surface in said die attach region;
• encapsulant, said encapsulant comprising an outer surface, said encapsulant covering a portion of said substrate first surface and said pressure sensor die, said encapsulant comprising a cavity over said pressure sensor die first surface, said cavity in said encapsulant comprising a length and width parallel to said pressure sensor die first surface of approximately 1.0 mm square and a cavity depth perpendicular to said pressure sensor die first surface of approximately at least 0.254 mm, such that a first region of said pressure sensor die first surface is not covered by said encapsulant;
• coupling gel, said coupling gel filling at least a portion of said cavity in said encapsulant such that said coupling gel covers said first region of said pressure sensor die first surface;
• and
• a substrate through hole in said substrate, said substrate through hole extending from said substrate second surface to said substrate first surface in said die attach region wherein, said die hole is at least partially aligned with said substrate through hole.

An array of pressure sensor die packages comprising:

• a plurality of pressure sensor dice, said pressure sensor dice each comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface;
• an array substrate, said array substrate comprising an array substrate first surface and an array substrate second surface, opposite said array substrate first surface, said array substrate first surface comprising a plurality of die attach regions, said pressure sensor dice second surfaces being attached to said die attach regions such that no more than one pressure sensor die is attached in each die attach region;
• encapsulant, said encapsulant comprising an outer surface, said encapsulant covering a portion of said array substrate first surface and said pressure sensor dice, said encapsulant comprising a plurality of cavities over said pressure sensor dice first surfaces such that a first region of each of said pressure sensor dice first surfaces is not covered by said encapsulant;
• and
• coupling gel, said coupling gel filling at least a portion of each of said plurality of cavities in said encapsulant such that said first regions of said first surfaces of each of said plurality of pressure sensor dice is covered by said coupling gel.

An array of pressure sensor die packages comprising:

• a plurality of pressure sensor dice, said pressure sensor dice each comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface, each of said plurality of pressure sensor dice being a differential pressure sensor die, said plurality of pressure sensor dice each comprising a die hole connecting said second surface of each of said pressure sensor dice to a corresponding cavity formed in each of said pressure sensor dice;
• an array substrate, said array substrate comprising an array substrate first surface and an array substrate second surface, opposite said array substrate first surface, said array substrate first surface comprising a plurality of die attach regions, said pressure sensor dice second surfaces being attached to said die attach regions such that no more than one pressure sensor die is attached in each die attach region;
• encapsulant, said encapsulant comprising an outer surface, said encapsulant covering a portion of said array substrate first surface and said pressure sensor dice, said encapsulant comprising a plurality of cavities over said pressure sensor dice first surfaces such that a first region of each of said pressure sensor dice first surfaces is not covered by said encapsulant;
• coupling gel, said coupling gel filling at least a portion of each of said plurality of cavities in said encapsulant such that said first regions of said first surfaces of each of said plurality of pressure sensor dice is covered by said coupling gel;
• and
• a plurality of substrate through holes in said array substrate, each of said plurality of substrate through holes extending from said array substrate second surface to said array substrate first surface in each of said plurality of die attach regions wherein, each of said die holes is at least partially aligned with one of said plurality of substrate through holes.

A pressure sensor package comprising:

• pressure sensor means, said pressure sensor means comprising a pressure sensor means first surface and a pressure sensor means second surface, opposite said pressure sensor means first surface;
• a support means, said support means comprising a support means first surface and a support means second surface, opposite said support means first surface, said support means first surface comprising a pressure sensor means attach region;
• means for attaching said pressure sensor means second surface to said support means first surface in said pressure sensor means attach region;
• and
• means for forming a cavity over a first region of said pressure sensor means first surface, said cavity comprising side surfaces and a bottom surface wherein;
• said first region of said pressure sensor means first surface is said bottom surface of said cavity and said first region of said pressure sensor means first surface is exposed at the bottom of said cavity;
• and
• coupling means for covering said first region of said first surface of said pressure sensor means at the bottom of said cavity, said coupling means filling at least a portion of said cavity.