Semiconductor device having resin members provided separately corresponding to externally connecting electrodes
AssigneeSharp Kabushiki Kaisha
InventorsMasato Sumikawa, Kazumi Tanaka, Tomotoshi Sato
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Abstract
A semiconductor device having a plurality of externally connecting electrodes arranged on a semiconductor chip includes on-chip electrodes, resin members formed separately from each other and provided corresponding to the plurality of externally connecting electrodes, and interconnections connecting the corresponding on-chip electrode and the corresponding externally connecting electrode. Such separately formed resin members for the externally connecting electrodes allow relaxation of thermal stress produced in the externally connecting electrodes.
Claims16
A semiconductor device having a plurality of externally connecting electrodes arranged on a semiconductor chip, comprising:
- on-chip electrodes;
- resin members formed separately from each other and provided corresponding to said plurality of said externally connecting electrodes, each of said resin members is arranged in an arbitrary position except on said on-chip electrodes;
- and
- interconnections, each of said interconnections connecting a corresponding on-chip electrode and a corresponding externally connecting electrode formed on a corresponding resin member.
A semiconductor device having a plurality of externally connecting electrodes arranged on a semiconductor chip, comprising:
- on-chip electrodes;
- resin members having slopes and provided corresponding to said plurality of externally connecting electrodes;
- and
- interconnections, each of said interconnections formed along the slope of a corresponding resin member and connecting a corresponding on-chip electrode and a corresponding externally connecting electrode.
A semiconductor device having a plurality of externally connecting electrodes arranged on a semiconductor chip, comprising:
- on-chip electrodes;
- a resin layer covering said semiconductor chip and having at least one opening, said externally connecting electrodes being formed immediately above the resin layer;
- and
- interconnections, each of said interconnections connecting a corresponding on-chip electrode and a corresponding externally connecting electrode.
Dependencies are inferred from the claim text.