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US 6,441,499 B1Granted
Thin form factor flip chip ball grid array
AssigneeLSI Logic Corporation
InventorsKumar Nagarajan, Sarathy Rajagopalan
Life of this patent
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Abstract
A method for making a flip chip ball grid array (BGA) package includes the step of thinning a die for matching a composite coefficient of thermal expansion to that of a second level board.
Claims7
A flip chip ball grid array package comprising a thin die having a die thickness for matching a composite coefficient of thermal expansion to that of a second level board.
Dependencies are inferred from the claim text.