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US 6,441,495 B1Granted
Semiconductor device of stacked chips
AssigneeRohm Co., Ltd.
InventorsHiroshi Oka, Masaaki Hiromitsu
Life of this patent
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Abstract
A semiconductor device comprises a plurality of semiconductor chips stacked in the direction of thickness. Each of the semiconductor chips includes an upper or lower surface formed with electrodes. The semiconductor device further comprises a plurality of terminal portions disposed beside these semiconductor chips, and a plural pieces of wire for electrical connection from the electrodes to respective terminal portions. Each of the terminal portions is at an elevation lower than the highest electrodes, and higher than the lowest electrodes.
Claims8
A semiconductor device comprising:
- a plurality of semiconductor chips stacked one above another in a thickness direction, each of the semiconductor chips including an upper surface provided with electrodes;
- a plurality of terminals arranged beside the stack of semiconductor chips;
- and
- a plurality of wires provided for electrically connecting from the electrodes to the terminals, each of the wires having a first end bonded to a respective one of the electrodes by ball bonding, each of the wires having a second end bonded to a respective one of the terminals by non-ball bonding;
- wherein the second ends of all the wires and the terminals connected to the second ends are contained in a common plane that is lower than the electrodes of a highest one of the semiconductor chips but higher than the electrodes of a lowest one in the stack of the semiconductor chips.
2 more elements
Dependencies are inferred from the claim text.