Circuit board having interconnection ball lands and ball grid array (BGA) package using the circuit board

A circuit board on which a semiconductor chip is mounted and having a chip mounting surface in which wiring patterns are formed and a solder ball mounting surface in which a plurality of solder balls are mounted and electrically interconnected to the wiring patterns, comprises:

• a plurality of ball lands each directly connected to the respective one of the plurality of solder balls;
• solder ball opening areas defined by a solder ball mask deposited on the solder ball mounting surface, and exposing the ball land through the solder ball mask;
• a plurality of pattern connecting portions each connected to corresponding one of the ball lands;
• and
• conductive wiring patterns connected with the pattern connecting portions and electrically interconnected to the solder balls,
• wherein said plurality of pattern connecting portions are aligned radially inwardly, starting from the ball lands, toward a substantially center point of the solder ball mounting surface.

A circuit board having a chip mounting surface and an interconnection ball mounting surface, comprising:

• interconnection ball lands formed on the interconnection ball mounting surface;
• a mask of a dielectric material formed on the interconnection ball mounting surface, the mask having interconnection ball opening areas defined therein, and exposing the ball lands through the mask;
• pattern connecting portions electrically connected to the ball lands;
• and
• conductive wiring patterns connected with the pattern connecting portions,
• wherein said plurality of pattern connecting portions are aligned inwardly radially toward substantially a center point of the interconnection ball mounting surface.