Apparatus for electrically mounting an electronic device to a substrate without soldering
AssigneeAmkor Technology, Inc.
InventorThomas P. Glenn
Life of this patent
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Abstract
An apparatus for mounting an electronic device on a substrate without soldering is disclosed. The apparatus includes a body and a plurality of cantilever beams extending from the body. The apparatus is mounted on the substrate. The electronic device is placed within the apparatus. In one embodiment, the cantilever beams press against the electronic device. In another embodiment, the cantilever beams engage the substrate. The apparatus presses an array of electrical contacts of the electronic device (e.g., interconnection balls) against corresponding metal pads of the substrate, thereby forming an electrical connection.
Claims15
A mounting for an electronic device comprising:
- an electronic device having a first side, an opposite second side, and an array of electrically conductive contacts at the first side;
- a substrate having electrically conductive pads at a first side thereof, and
- an apparatus on the first side of the substrate, wherein the apparatus includes a body with a plurality of cantilever beams extending therefrom, the electronic device is within the apparatus, and the beams contact the second side of the electronic device and apply a continuous force to the electronic device, which force presses the contacts of the electronic device against the pads of the substrate forming an electrical connection.
Dependencies are inferred from the claim text.