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US 6,441,484 B2Granted
Semiconductor device having switching elements around a central control circuit
AssigneesHitachi, Ltd., Hitachi Tohbu Semiconductor, Ltd.
InventorsKenji Koyama, Norinaga Arai, Akio Mikami, Mamoru Iizuka
Life of this patent
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Abstract
A semiconductor device comprises: a first semiconductor chip having a control circuit; a plurality of second semiconductor chips whose operation is controlled by the control circuit; and a resin sealing body for sealing the first semiconductor chip and the plurality of second semiconductor chips, wherein: the first semiconductor chip is arranged in the central portion of the resin sealing body; and the plurality of second semiconductor chips are arranged on a periphery of the first semiconductor chip. A fuse element is further arranged outside the plurality of second semiconductor chips.
Claims18
A semiconductor device comprising:
- a first semiconductor chip having a control circuit;
- a plurality of second semiconductor chips each having a switching element;
- and
- a resin sealing body, whose plane is formed in a quadrilateral shape, for sealing said first semiconductor chip and said plurality of second semiconductor chips, wherein:
- said first semiconductor chip is arranged in the central portion of said resin sealing body away from the periphery of the same;
- and
- said plurality of second semiconductor chips are arranged on a periphery of said first semiconductor chip.
4 more elements
A semiconductor device comprising:
- a first semiconductor chip having on one main surface a control circuit and a plurality of electrodes;
- a plurality of second semiconductor chips each having on one main surface a switching element and an electrode;
- a plurality of bonding wires for electrically connecting the plurality of electrodes of said first semiconductor chip and respective electrodes of said plurality of second semiconductor chips;
- and
- a resin sealing body for sealing said first semiconductor chip, said plurality of second semiconductor chips and said plurality of bonding wires, wherein:
- said first semiconductor chip is arranged in the central portion of said resin sealing body away from the periphery of the same;
- and
- said plurality of second semiconductor chips are arranged on a periphery of said first semiconductor chip.
5 more elements
A semiconductor device comprising:
- a first semiconductor chip which has a control circuit and whose plane is formed in a quadrilateral shape;
- four second semiconductor chips each having a switching element;
- and
- a resin sealing body for sealing said first semiconductor chip and said four second semiconductor chips, wherein:
- said first semiconductor chip is arranged in the central portion of said resin sealing body;
- and
- said four second semiconductor chips are separately arranged outside the four corners of said first semiconductor chip.
4 more elements
A semiconductor device comprising:
- a first semiconductor chip which has on one main surface a control circuit and a plurality of electrodes and whose plane is formed in a quadrilateral shape;
- four second semiconductor chips each having on one main surface a switching element and an electrode;
- a plurality of bonding wires for electrically connecting the plurality of electrodes of said first semiconductor chip to respective electrodes of said four second semiconductor chips;
- and
- a resin sealing body for sealing said first semiconductor chip, said four second semiconductor chips and said plurality of bonding wires, wherein:
- said first semiconductor chip is arranged in the central portion of said resin sealing body;
- and
- said second semiconductor chips are separately arranged outside the four corners of said first semiconductor chip.
5 more elements
A semiconductor device comprising:
- a first semiconductor chip having a control circuit;
- a plurality of second semiconductor chips having said switching elements;
- a plurality of fuse elements whose fusible portions are fused by their own heat when an overcurrent flows;
- and
- a resin sealing body for sealing said first semiconductor chip, said plurality of second semiconductor chips and said plurality of fuse elements, wherein:
- said first semiconductor chip is arranged in the central portion of said resin sealing body;
- said plurality of second semiconductor chips are arranged on a periphery of said first semiconductor chip, and
- said plurality of fuse elements are arranged on a periphery of said first semiconductor chip and farther out than said second semiconductor chips.
5 more elements
A semiconductor device comprising:
- a first semiconductor chip having a control circuit and a plurality of electrodes on one main surface;
- a plurality of second semiconductor chips each having a fuse element and an electrode on one main surface;
- a plurality of fuse elements whose fusible portions are fused by their own heat when an overcurrent flows;
- a plurality of bonding wires for electrically connecting the plurality of electrodes of said first semiconductor chip to respective electrodes of said plurality of second semiconductor chips, and
- a resin sealing body for sealing said first semiconductor chip, said plurality of second semiconductor chips and said plurality of bonding wires, wherein:
- said first semiconductor chip is arranged in the central portion of said resin sealing body;
- said plurality of second semiconductor chips are arranged on a periphery of said first semiconductor chip, and
- said plurality of fuse elements are arranged on a periphery of said first semiconductor chip and farther out than said second semiconductor chips.
5 more elements
A semiconductor device comprising:
- a first semiconductor chip which has a control circuit and whose plane is formed in a quadrilateral shape;
- four second semiconductor chips each having a switching element;
- four fuse elements whose fusible portions are fused by their own heat when an overcurrent flows;
- and
- a resin sealing body for sealing said first semiconductor chip, said four second semiconductor chips and four fuse elements, wherein:
- said first semiconductor chip is arranged in the central portion of said resin sealing body;
- said four second semiconductor chips are separately arranged outside the four corners of said first semiconductor chip;
- and
- said four fuse elements are separately arranged outside the four corners of said first semiconductor chip and farther out than said second semiconductor chips.
6 more elements
A semiconductor device comprising:
- a first semiconductor chip having on one main surface a control circuit and a plurality of electrodes;
- four second semiconductor chips each having on one main surface a switching element and an electrode;
- four fuse elements whose fusible portions are fused by their own heat when an overcurrent flows;
- a plurality of bonding wires for electrically connecting the plurality of electrodes of said first semiconductor chip to respective electrodes of said four second semiconductor chips;
- and
- a resin sealing body for sealing said first semiconductor chip, said four second semiconductor chips, said four fuse elements and said plurality of bonding wires, wherein:
- said first semiconductor chip is arranged in the central portion of said resin sealing body;
- said second semiconductor chips are separately arranged outside the four corners of said first semiconductor chip
- said four fuse elements are separately arranged outside the four corners of said first semiconductor chip and farther out than said second semiconductor chips.
6 more elements
Dependencies are inferred from the claim text.