US 6,441,483 B1 · Die stacking scheme

Abstract

An improved die stacking scheme is provided. In accordance with one embodiment of the present invention, a multiple die semiconductor assembly is provided comprising a substrate, first and second semiconductor dies, and at least one decoupling capacitor. The first semiconductor die defines a first active surface. The first active surface includes at least one conductive bond pad. The second semiconductor die defines a second active surface, the second active surface includes at least one conductive bond pad. The first semiconductor die is interposed between the substrate and the second semiconductor die such that a surface of the second semiconductor die defines an uppermost die surface of the multiple die semiconductor assembly and such that a surface of the first semiconductor die defines a lowermost die surface of the multiple die semiconductor assembly. The decoupling capacitor is secured to the uppermost die surface and is conductively coupled to at least one of the first and second semiconductor dies.

Claims11

Dependent claims

A multiple die semiconductor assembly comprising:

a substrate including a first surface and conductive contacts included on said first surface;
a first semiconductor die including a pair of major surfaces, wherein
one of said pair of major surfaces of said first die defines a first active surface,
the other of said major surfaces of said first die defines a first stacking surface,
said first active surface includes at least one conductive bond pad, and
said first stacking surface is secured to said first surface of said substrate;
a second semiconductor die including a pair of major surfaces, wherein
one of said pair of major surfaces of said second die defines a second active surface,
the other of said major surfaces of said second die defines a second stacking surface,
said second active surface includes at least one conductive bond pad,
said first semiconductor die is electrically coupled to said second semiconductor die by at least one topographic contact extending from a conductive bond pad on said second active surface to a conductive bond pad on said first active surface;
at least one decoupling capacitor secured to said second stacking surface;
and
at least one conductive line connecting said decoupling capacitor, a bond pad on said first active surface, and a conductive contact on said first surface of said substrate.

11 more elements

A printed circuit board assembly comprising:

a substrate including first and second surfaces and conductive contacts included on said first surface;
a first semiconductor die including a pair of major surfaces, wherein
one of said pair of major surfaces of said first die defines a first active surface,
the other of said major surfaces of said first die defines a first stacking surface,
said first active surface includes a plurality of conductive bond pads, and
said first stacking surface is devoid of conductive bond pads and is secured to said first surface of said substrate between said conductive contacts included on said first surface of said substrate;
a second semiconductor die including a pair of major surfaces, wherein
one of said pair of major surfaces of said second die defines a second active surface,
the other of said major surfaces of said second die defines a second stacking surface,
said second active surface includes a plurality of conductive bond pads,
said first semiconductor die is electrically coupled to said second semiconductor die by a plurality of topographic contacts extending from respective conductive bond pads on said second active surface to a corresponding conductive bond pad on said first active surface;
a single decoupling capacitor secured to said second stacking surface;
a pair of conductive lines, each of said conductive lines connecting a terminal of said decoupling capacitor, a bond pad on said first active surface, and a conductive contact on said first surface of said substrate, wherein said bond pad on said first active surface is electrically coupled to said second semiconductor die via one of said plurality of topographic contacts extending from respective conductive bond pads on said second active surface to a corresponding conductive bond pad on said first active surface, and wherein said pair of conductive lines are arranged such that said decoupling capacitor is connected across Vss and Vcc pins of said first and second semiconductor dies;
a printed circuit board positioned such that a first surface of said printed circuit board faces said substrate;
and
a plurality of topographic contacts extending from said second surface of said substrate to said first surface of said printed circuit board.

13 more elements

A printed circuit board assembly comprising:

a substrate including a first surface and conductive contacts included on said first surface;
a first semiconductor die including a pair of major surfaces, wherein
one of said pair of major surfaces of said first die defines a first active surface,
the other of said major surfaces of said first die defines a first stacking surface,
said first active surface includes a plurality of conductive bond pads, and
said first active surface is electrically coupled to said substrate by a plurality of topographic contacts extending from respective conductive bond pads on said first active surface to corresponding conductive contacts on said first surface of said substrate;
a second semiconductor die including a pair of major surfaces, wherein
one of said pair of major surfaces of said second die defines a second active surface,
the other of said major surfaces of said second die defines a second stacking surface,
said second active surface includes a plurality of conductive bond pads, and
said first stacking surface is devoid of conductive bond pads and is secured to said second stacking surface;
a single decoupling capacitor secured to said second active surface;
and
a pair of conductive lines, each of said conductive lines connecting a terminal of said decoupling capacitor, a bond pad on said second active surface, and a conductive contact on said first surface of said substrate, wherein said conductive contact on said first surface of said substrate is electrically coupled to said first semiconductor die via one of said plurality of topographic contacts extending from respective conductive bond pads on said first active surface to corresponding conductive contacts on said first surface of said substrate, and wherein said pair of conductive lines are arranged such that said decoupling capacitor is connected across Vss and Vcc pins of said first and second semiconductor dies;
a printed circuit board positioned such that a first surface of said printed circuit board faces said substrate;
and
a plurality of topographic contacts extending from said substrate to said first surface of said printed circuit board.

14 more elements

Dependencies are inferred from the claim text.

Die stacking scheme

Life of this patent

Die stacking scheme

Life of this patent

Abstract

Claims11