Back to results
US 6,441,479 B1Granted
System-on-a-chip with multi-layered metallized through-hole interconnection
AssigneeMicron Technology, Inc.
InventorsKie Y. Ahn, Leonard Forbes
Life of this patent
Estimating the term…
Abstract
The present invention is directed to a high-performance system on a clip which uses multi-layer wiring/insulation through-hole interconnections to provide short wiring and controlled low-impedance wiring including ground planes and power supply distribution planes between chips.
Claims85
A chip mounting system comprising:
- a substrate for mounting at least one chip, said substrate having at least one through-hole and at least one circuit component formed thereon;
- a multi-layer structure covering both sides of said substrate and passing through said at least one through-hole, said multi-layer structure comprising at least one conductive plane and a signal wiring layer, said at least one conductive plane and said signal wiring layer having an insulating layer interposed between them;
- and
- wherein said signal wiring layer has a first signal line in electrical communication with said at least one circuit component.
1 more element
A chip mounting system comprising:
- a substrate for mounting at least a first chip and a second chip, said substrate having at least one through-hole;
- a multi-layer structure covering both sides of said substrate and passing through said through-hole, said multi-layer structure comprising a conductive plane and a signal wiring layer having traces terminating in bond pads on said both sides of said substrate, said conductive plane and said signal wiring layer having an insulating layer interposed between them;
- and
- said at least first chip and second chip mounted onto said bond pads on opposite sides of said substrate.
1 more element
An integrated circuit package comprising:
- a substrate for mounting at least one chip, said substrate having at least one through-hole;
- a multi-layer structure covering both sides of said substrate and passing through said through-hole, said multi-layer structure comprising a conductive plane and a signal wiring layer, said conductive plane and said signal wiring layer having an insulating layer interposed between them, wherein said signal wiring layer has interconnect wiring extending to opposite sides of said multi-layer structure;
- and
- an integrated circuit package to encase said substrate, said multi-layer structure and at least one circuit chip.
1 more element
Dependencies are inferred from the claim text.