Semiconductor package having metal-pattern bonding and method of fabricating the same
AssigneeDongbu Electronics Co., Ltd.
InventorKye Chan Park
Life of this patent
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Abstract
A semiconductor package including a semiconductor chip having bonding pads respectively arranged in a line adjacent to four sides of the upper surface; gold bumps formed on each bonding pad; a glass substrate which is made by forming metal patterns, the metal pattern including an inner pattern electrically connected to the bonding pad of the semiconductor chip through the gold bumps, an outer pattern, and a connecting pattern between the inner pattern and the outer pattern: a Dam having a frame-shape on the connecting pattern and surrounding the inner patterns; sealing material sealing the space between the glass substrate around the semiconductor chip and solder balls attached on the outer patterns of each metal pattern.
Claims30
A semiconductor package comprising,
- a semiconductor chip having bonding pads respectively arranged in a line adjacent to four sides of the upper surface;
- gold bumps formed on each bonding pad;
- a glass substrate which is made by forming metal patterns corresponding to the bonding pads on one side, the metal patterns including an inner pattern electrically connected to the bonding pad of the semiconductor chip through the gold bump, an outer pattern separated from the inner pattern and connecting pattern between the inner pattern and the outer pattern and then forming a Dam in a frame-shape on the connecting pattern and on the one side to surround the inner patterns;
- sealing material sealing the space between the glass substrate and the semiconductor chip on an outer side of the Dam except for the outer pattern of the metal pattern;
- and
- solder balls attached on the outer patterns of each metal pattern.
A method of fabricating a semiconductor package comprising the steps of preparing a semiconductor chip having bonding pads arranged in a line adjacent to four sides of an upper surface and a glass substrate on which metal patterns are formed, each metal pattern having an inner pattern, an outer pattern and a connecting pattern on a position corresponding to the bonding pads;
- forming gold bumps on each bonding pad;
- forming a Dam in a frame-shape surrounding each inner pattern on each connecting pattern and on one side of the glass substrate;
- bonding the semiconductor chip and the glass substrate by using the gold bumps to electrically connect the bonding pad and each inner pattern;
- sealing a space between the glass substrate and the semiconductor chip on an outer side of the Dam except for each outer pattern;
- and
- attaching solder balls on the outer pattern of each metal pattern.
Dependencies are inferred from the claim text.