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US 6,441,476 B1Granted
Flexible tape carrier with external terminals formed on interposers
AssigneeSeiko Epson Corporation
InventorYoshiaki Emoto
Life of this patent
Estimating the term…
Abstract
In order to provide a semiconductor apparatus in which both semiconductor chips and interposers are provided on a carrier tape, electrical properties can be improved using short wiring in a wiring pattern substantially symmetric with respect to the semiconductor chips, production can become easier, and compactness and heat radiation can be improved. Semiconductor chips electrically connected to wiring formed on the carrier tape, and interposers on the carrier tape and surrounding the semiconductor chips, are provided next to each other.
Claims7
A semiconductor apparatus, comprising:
- a semiconductor chip electrically connected to wiring formed on a carrier tape;
- and
- interposers formed on the carrier tape and surrounding said semiconductor chip, the interposers being provided next to each other, each of the interposers having areas to form a plurality of external connection terminals, the semiconductor chip and interposers overlapping by bending the carrier tape such that the semiconductor chip, positioned in a center, is enclosed, and the enclosed semiconductor chip is covered by a molding resin.
A semiconductor apparatus, comprising:
- a plurality of semiconductor chips arranged in a row and electrically connected to wiring formed on a carrier tape;
- and
- a plurality of interposers formed on the carrier tape and on a top side and a bottom side of a semiconductor chip positioned in a center, the interposers overlapping, one surface of the semiconductor chip in the center while the semiconductor chips overlapping another surface, the enclosed semiconductor chip is covered by a molding resin, and external terminals are formed on the interposers.
Dependencies are inferred from the claim text.