Clear coating for digital and analog imagers
AssigneeConexant Systems, Inc.
InventorGary D. Tindle
Life of this patent
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AssigneeConexant Systems, Inc.
InventorGary D. Tindle
Estimating the term…
A semiconductor die with an imager sensor on an integrated circuit (IC) is mated directly to a substrate, such as a printed circuit board or any traditional chip carrier. A retaining well is built by adding an elevated structure about the mated IC chip with an inexpensive epoxy compound, forming a recess in which the IC is disposed. Thereafter, a coating layer of a viscous epoxy is added to the well and allowed to cure. The coating is clear, allowing light to pass to the IC chip. The epoxy along with the substrate encapsulates the IC chip, providing an easy and inexpensive chip package. The substrate may comprise a laminate substrate that is preprinted with easily reconfigurable leads and multi-layer routing arranged to minimize noise and cross-talk. The coating, or an additional coating placed on top of or underneath the clear coating, may also perform filtering of one or more portions of the light spectrum. The IC may alternatively comprise any type of circuitry that responds to received light or that generates light.
An imaging device comprising:
A method for packaging an integrated circuit die using a carrier, the integrated circuit die comprising imager circuitry and a first plurality of contacts, the carrier comprising a second plurality of contacts, the method comprising:
An electrical component that utilizes at least a portion of a visible light spectrum, the electrical component comprising:
An imaging device comprising:
A method for packaging an integrated circuit die using a carrier, the integrated circuit die comprising imager circuitry and a first plurality of contacts, the carrier comprising a second plurality of contacts, the method comprising:
An electrical component that utilizes at least a portion of a visible light spectrum, the electrical component comprising:
Dependencies are inferred from the claim text.