Semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsHidetoshi Nakanishi, Masakazu Kobayashi, Toshio Chaki
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AssigneeKabushiki Kaisha Toshiba
InventorsHidetoshi Nakanishi, Masakazu Kobayashi, Toshio Chaki
Estimating the term…
In order that the threshold value of a cell separated from an emitter wire bonding portion (W1, W2) be larger than that of a cell immediately below the emitter wire bonding portion, the area of a diffusion layer (8a) of a cell separated from the wire bonding portion is made larger than that of a diffusion layer (8) for connecting an emitter electrode (2) and a base region (7) in a cell immediately below the wire bonding portion. This allows a hole current to be discharged outside via an emitter wire within a short time period, without adversely affecting the operating characteristics and the steady loss, in a position where this hole current readily remains upon turn-off in a conventional IGBT. This shortens the fall time and reduces the switching loss.
An insulated gate bipolar semiconductor device in which a plurality of cells are formed, and an emitter region of each of said plurality of cells is connected to at least one emitter wire in at least one bonding portion via a common emitter electrode,
Dependencies are inferred from the claim text.