Thermal type infrared ray detector with thermal separation structure for high sensitivity

A thermal type infrared ray detector with a thermal separation structure comprising

• a plurality of picture elements, each of which comprises:
• a circuit formed in a substrate for every picture element;
• a light receiving section converting infrared rays into change of a resistance or a charge quantity and said circuit generates a voltage signal from said resistance change or said charge quantity change;
• and
• beams mechanically supporting said light receiving section from said substrate to form a gap between said light receiving section and said substrate, and
• electrically connecting said light receiving section to said circuit,
• wherein each of said beams includes:
• a wiring line film formed of Ti alloy and connecting said light receiving section to said circuit;
• and
• a protective insulating film surrounding said wiring line film, wherein
• said light receiving section is connected to said circuit via contact pads,
• said contact pad for a first of said plurality of picture elements and said contact pad of a second of said plurality of picture elements which is disposed in a diagonal direction from said first picture element are structurally unified and electrically insulated.

A thermal type infrared ray detector with a thermal separation structure comprising a plurality of picture elements, each of which comprises:

• a circuit formed in a substrate for every picture element;
• a light receiving section converting infrared rays into change of a resistance or a charge quantity, and said circuit generates a voltage signal from said resistance change or said charge quantity change;
• and
• beams mechanically supporting said light receiving section from said substrate to form a gap between said light receiving section and said substrate, and electrically connecting said light receiving section to said circuit,
• each of said beams includes:
• a wiring line film formed of Ti alloy and connecting said light receiving section to said circuit;
• and
• a protective insulating film surrounding said wiring line film, and
• a signal line for transferring said voltage signal to said circuit and a ground line are formed in said substrate,
• wherein said Ti alloy is TiAl6V4.

A thermal type infrared ray detector with a thermal separation structure comprising a plurality of picture elements, each of which comprises:

• a circuit formed in a substrate for every picture element;
• a light receiving section converting infrared rays into change of a resistance or a charge quantity, and said circuit generates a voltage signal from said resistance change or said charge quantity change;
• and
• beams mechanically supporting said light receiving section from said substrate to form a gap between said light receiving section and said substrate, and electrically connecting said light receiving section to said circuit,
• each of said beams includes:
• a wiring line film formed of Ti alloy and connecting said light receiving section to said circuit;
• and
• a protective insulating film surrounding said wiring line film, and a signal line for transferring said voltage signal to said circuit and a ground line are formed in said substrate, wherein said light receiving section is connected to said circuit via contact pads, said contact pad for a first of said plurality of picture elements and said contact pad of a second of said plurality of picture elements which is disposed in a diagonal direction from said first picture element are structurally unified and electrically insulated.

A thermal type infrared ray detector with a thermal separation structure comprising a plurality of picture elements, each of which comprises:

• a circuit formed in a substrate for every picture element;
• a light receiving section converting infrared rays into change of a resistance or a charge quantity, and said circuit generates a voltage signal from said resistance change or said charge quantity change;
• and
• beams mechanically supporting said light receiving section from said substrate to form a gap between said light receiving section and substrate, and electrically connecting said light receiving section to said circuit via contact pads,
• wherein each of said beams includes:
• a wiring line film formed of Ti alloy and connecting said light receiving section to said circuit;
• and
• a protective insulating film surrounding said wiring line film, and
• wherein said contact pad for a first of said plurality of picture elements and said contact pad of a second of said plurality of picture elements which is disposed in a diagonal direction from said first picture element are structurally unified and electrically insulated.