Inserted components for via connection of signal tracks to achieve continuous impedance matching in multi-layer substrate
AssigneeNortel Networks Limited
InventorsMartin R. Handforth, Herman Kwong, Richard R. Goulette, Rolf G. Meier
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Abstract
A technique for connecting signal tracks within a multi-layer substrate is disclosed. In one embodiment, the technique is realized by providing an opening in a substrate and fitting an inserted component into the opening. The inserted component comprises a dielectric block mounted to a lead frame. The lead frame is conductive such that a signal layer formed between the inserted component and the substrate connects signal tracks on multiple signal layers of the substrate.
Claims26
A method for connecting signal tracks on different layers in a multi-layer substrate, the method comprising the steps of:
- forming an opening in the substrate through at least two adjacent electrically conducting layers of the substrate;
- inserting a first component into the opening, the first component comprising a conductive layer, the first component extending through the substrate such that the conductive layer electrically connects at least two signal tracks on different signal layers of the substrate;
- and
- bonding the first component to the substrate.
A substrate comprising:
- a plurality of signal tracks on different layers;
- an opening formed in at least two electrically conducting layers of the substrate;
- and
- a first component inserted in the opening, the first component comprising a conductive layer, wherein placement of the first component creates an electrical connection between at least two signal tracks on different layers of the substrate.
A system for connecting signal tracks on different layers within a multi-layer substrate, the system comprising:
- a first passive component insertable into a substrate, the first passive component shaped to contact at least two signal tracks on different layers of the multi-layer substrate;
- additional material shaped to be positioned adjacent the first inserted component so as to create an electrical conductor path between the additional material and the first inserted component and intersecting with the at least two signal layers.
Dependencies are inferred from the claim text.