Semiconductor module and inverter device

A semiconductor module comprising:

• a semiconductor element;
• an electrically insulating base having an outer surface to be connected to an electrically grounded surface, and an inner surface on which the semiconductor element is arranged;
• an electrically insulating cover covering the semiconductor element on the inner surface;
• and
• first and second electrically conductive members each of which is connected to the semiconductor element and extends to the exterior of the semiconductor module through the electrically insulating cover;
• wherein a part of each of the first and second electrically conductive members on the exterior of the semiconductor module is arranged away from the outer surface of the electrically insulating base to electrically isolate the part of the each of the first and second electrically conductive members from the electrically grounded surface;
• and
• a first electrically insulating spacer inserted in jelly-state into a space between the semiconductor element and the electrically insulating cover and cured between the semiconductor element and the electrically insulating cover, and a second electrically insulating spacer inserted in solid-state between areas of the first and second electrically conductive members facing close to each other to form a mutual inductance therebetween.

A semiconductor module comprising:

• a semiconductor element;
• an electrically insulating base having an outer surface to be connected to an electrically grounded surface, and an inner surface on which the semiconductor element is arranged;
• an electrically insulating cover covering the semiconductor element on the inner surface;
• and
• first and second electrically conductive members each of which is connected to the semiconductor element and extends to the exterior of the semiconductor module through the electrically insulating cover;
• wherein a part of each of the first and second electrically conductive members on the exterior of the semiconductor module is arranged away from the outer surface of the electrically insulating base to electrically isolate the part of the each of the first and second electrically conductive members from the electrically grounded surface;
• and
• wherein at least one of the first and second electrically conductive members includes a first bent portion, a second bent portion and a third bent portion arranged in series while the second bent portion is arranged between the first and third bent portions in a current flow direction in which an electric current flows when the electric current is supplied to the semiconductor element, the first, second and third bent portions are bent around respective axes parallel to each other and perpendicular to a thickness direction of the at least one of the first and second electrically conductive members at the first, second and third bent portions, and a portion of the at least one of the first and second electrically conductive members between the first and third bent portion is prevented from contacting with the electrically insulating cover.

A semiconductor module comprising:

• a semiconductor element;
• an electrically insulating base having an outer surface to be connected to an electrically grounded surface, and an inner surface on which the semiconductor element is arranged;
• an electrically insulating cover covering the semiconductor element on the inner surface;
• and
• first and second electrically conductive members each of which is connected to the semiconductor element and extends to the exterior of the semiconductor module through the electrically insulating cover;
• wherein a part of each of the first and second electrically conductive members on the exterior of the semiconductor module is arranged away from the outer surface of the electrically insulating base to electrically isolate the part of the each of the first and second electrically conductive members from the electrically grounded surface;
• wherein when an electric current is supplied to the semiconductor element through the first electrically conductive member, at least a part of the electric current is output from the semiconductor module through the second electrically conductive member, and the first and second electrically conductive members are arranged close to each other to form a mutual inductance therebetween;
• wherein the first and second electrically conductive members have respective relatively-wide portions facing close to each other, and a directional component of electric current in one of the relatively-wide portions is opposite to another directional component of electric current in another one of the relatively-wide portions;
• wherein the first and second electrically conductive members have respective relatively-narrow portions adjacent to the relatively-wide portions, and a cross- sectional area of each of the relatively-wide portions is larger than that of each of the relatively-narrow portions as seen in a current flow direction in which the electric current flows to concentrate the electric current to areas of the relatively-wide portions adjacent to the relatively-narrow portions;
• wherein at least one of the first and second electrically conductive members is bent at the relatively-narrow portion around an axis perpendicular to a thickness direction of the at least one of the first and second electrically conductive members at the relatively-narrow portion;
• and
• wherein the at least one of the first and second electrically conductive members has at least two connecting feet each of which projects divergently from the relatively-narrow portion and is connected to the semiconductor element.

A semiconductor module comprising:

• a semiconductor element;
• an electrically insulating base having an outer surface to be connected to an electrically grounded surface, and an inner surface on which the semiconductor element is arranged;
• an electrically insulating cover covering the semiconductor element on the inner surface;
• and
• first and second electrically conductive members each of which is connected to the semiconductor element and extends to the exterior of the semiconductor module through the electrically insulating cover;
• wherein a part of each of the first and second electrically conductive members on the exterior of the semiconductor module is arranged away from the outer surface of the electrically insulating base to electrically isolate the part of the each of the first and second electrically conductive members from the electrically grounded surface;
• wherein when an electric current is supplied to the semiconductor element through the first electrically conductive member, at least a part of the electric current is output from the semiconductor module through the second electrically conductive member, and the first and second electrically conductive members are arranged close to each other to form a mutual inductance therebetween;
• wherein the first and second electrically conductive members have respective relatively-wide portions facing close to each other, and a directional component of electric current in one of the relatively-wide portions is opposite to another directional component of electric current in another one of the relatively-wide portions;
• wherein the first and second electrically conductive members have respective relatively-narrow portions adjacent to the relatively-wide portions, and a cross- sectional area of each of the relatively-wide portions is larger than that of each of the relatively-narrow portions as seen in a current flow direction in which the electric current flows to concentrate the electric current to areas of the relatively-wide portions adjacent to the relatively-narrow portions;
• and
• wherein a flowing direction of the electric current is bent by the relatively-narrow portion of at least one of the first and second electrically conductive members to increase a length of electric current path between the part of the at least one of the first and second electrically conductive members and the semiconductor element and to make the flowing direction of electric current from the relatively-narrow portion and the flowing direction of electric current to the relatively-narrow portion opposite to each other.

A semiconductor module comprising:

• a semiconductor element;
• an electrically insulating base having an outer surface to be connected to an electrically grounded surface, and an inner surface on which the semiconductor element is arranged;
• an electrically insulating cover covering the semiconductor element on the inner surface;
• and
• first and second electrically conductive members each of which is connected to the semiconductor element and extends to the exterior of the semiconductor module through the electrically insulating cover;
• wherein a part of each of the first and second electrically conductive members on the exterior of the semiconductor module is arranged away from the outer surface of the electrically insulating base to electrically isolate the part of the each of the first and second electrically conductive members from the electrically grounded surface;
• wherein when an electric current is supplied to the semiconductor element through the first electrically conductive member, at least a part of the electric current is output from the semiconductor module through the second electrically conductive member, and the first and second electrically conductive members are arranged close to each other to form a mutual inductance therebetween;
• wherein the first and second electrically conductive members have respective relatively-wide portions facing close to each other, and a directional component of electric current in one of the relatively-wide portions is opposite to another directional component of electric current in another one of the relatively-wide portions;
• and
• wherein, as seen in a direction perpendicular to the outer surface of the electrically insulating base, the relatively-wide portions face to each other in a direction substantially perpendicular to an imaginary line extending between the parts of the first and second electrically conductive members on the exterior of the semiconductor module.

A semiconductor module comprising:

• a semiconductor element;
• an electrically insulating base having an outer surface to be connected to an electrically grounded surface, and an inner surface on which the semiconductor element is arranged;
• an electrically insulating cover covering the semiconductor element on the inner surface;
• and
• first and second electrically conductive members each of which is connected to the semiconductor element and extends to the exterior of the semiconductor module through the electrically insulating cover;
• wherein a part of each of the first and second electrically conductive members on the exterior of the semiconductor module is arranged away from the outer surface of the electrically insulating base to electrically isolate the part of the each of the first and second electrically conductive members from the electrically grounded surface;
• wherein when an electric current is supplied to the semiconductor element through the first electrically conductive member, at least a part of the electric current is output from the semiconductor module through the second electrically conductive member, and the first and second electrically conductive members are arranged close to each other to form a mutual inductance therebetween;
• wherein the first and second electrically conductive members have respective relatively-wide portions facing close to each other, and a directional component of electric current in one of the relatively-wide portions is opposite to another directional component of electric current in another one of the relatively-wide portions;
• and
• wherein both of the first and second electrically conductive members extend from the exterior of the semiconductor module toward the relatively-wide portions to flow respective electric currents obliquely to a direction perpendicular to the outer surface of the electrically insulating base between the exterior of the semiconductor module and the relatively-wide portions.

A semiconductor module comprising:

• a semiconductor element;
• an electrically insulating base having an outer surface to be connected to an electrically grounded surface, and an inner surface on which the semiconductor element is arranged;
• an electrically insulating cover covering the semiconductor element on the inner surface;
• and
• first and second electrically conductive members each of which is connected to the semiconductor element and extends to the exterior of the semiconductor module through the electrically insulating cover;
• wherein a part of each of the first and second electrically conductive members on the exterior of the semiconductor module is arranged away from the outer surface of the electrically insulating base to electrically isolate the part of the each of the first and second electrically conductive members from the electrically grounded surface;
• and
• a third electrically conductive member connected to the semiconductor element and extending to the exterior of the semiconductor module through the electrically insulating cover, wherein the semiconductor module is configured so that when electric current is supplied to the semiconductor element, a value of electric current flowing through the third electrically conductive member is significantly smaller than a value of electric current flowing through the each of the first and second electrically conductive members, a part of the third electrically conductive member on the exterior of the semiconductor module is arranged away from the outer surface of the electrically insulating base to electrically isolate the part of the third electrically conductive member from the electrically grounded surface, and a distance between the outer surface of the electrically insulating base and the part of each of the first and third electrically conductive members is less than a distance between the outer surface of the electrically insulating base and the part the second electrically conductive members in a direction perpendicular to the outer surface of the electrically insulating base.

A semiconductor module comprising:

• a semiconductor element;
• an electrically insulating base having an outer surface to be connected to an electrically grounded surface, and an inner surface on which the semiconductor element is arranged;
• an electrically insulating cover covering the semiconductor element on the inner surface;
• and
• first and second electrically conductive members each of which is connected to the semiconductor element and extends to the exterior of the semiconductor module through the electrically insulating cover;
• wherein a part of each of the first and second electrically conductive members on the exterior of the semiconductor module is arranged away from the outer surface of the electrically insulating base to electrically isolate the part of the each of the first and second electrically conductive members from the electrically grounded surface;
• wherein when an electric current is supplied to the semiconductor element through the first electrically conductive member, at least a part of the electric current is output from the semiconductor module through the second electrically conductive member, and the first and second electrically conductive members are arranged close to each other to form a mutual inductance therebetween;
• wherein the first and second electrically conductive members have respective relatively-wide portions facing close to each other, and a directional component of electric current in one of the relatively-wide portions is opposite to another directional component of electric current in another one of the relatively-wide portions;
• and
• wherein one of the relatively-wide portions is bent to partially surround partially another one of the relatively-wide portions.

An inverter device comprising a pair of first and second semiconductor modules each comprising:

• a semiconductor element;
• an electrically insulating base having an outer surface to be connected to an electrically grounded surface, and an inner surface on which the semiconductor element is arranged;
• an electrically insulating cover covering the semiconductor element on the inner surface;
• and
• first and second terminal surfaces on an exterior of the semiconductor module disposed so as to be contacted with a bus bar to form an electric communication between the semiconductor element and the bus bar;
• wherein when an electric current flows into the first and second terminal surfaces of the first semiconductor module from one of the bus bars, at least a part of the electric current flows out of the first and second terminal surfaces of the second semiconductor module into another one of the bus bars, the first and second terminal surfaces of the first semiconductor module and the first and second terminal surfaces of the second semiconductor module are arranged along a substantially straight imaginary line as seen in a direction perpendicular to the outer surface of the electrically insulating base, and a height between the outer surface of the electrically insulating base and an imaginary plane on which the first and second terminal surfaces of the first semiconductor module extend is different from a height between the outer surface of the electrically insulating base and another imaginary plane on which the first and second terminal surfaces of the second semiconductor module extend as seen in a direction parallel to the outer surface of the electrically insulating base.