Photosensitive polymer
AssigneeEverlight USA, Inc.
InventorsShang-Wern Chang, Yen-Cheng Li, Shang-Ho Lin
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Abstract
The present invention provides a photosensitive polymer containing the following structure unit of formula (II): Wherein R is hydrogen or C1-C4 alkyl group; R′ is C1-C4 alkyl group; n is an integer of 2, 3, 4, 5 or 6. This photosensitive polymer also relates to chemical amplified photoresist composition. This chemical amplified photoresist composition can be applied to general lithography processes, especially in 193 nm lithography and the patterns formed from the photoresist composition exhibit excellent resolution and photosensitivity.
Claims22
A photosensitive polymer, which containing the structure unit of formula (II),
- Wherein:
- R is hydrogen or C1-C4 alkyl group;
- R′ is C1-C4 alkyl group;
- n is an integer of 2, 3, 4, 5 or 6.
A photosensitive polymer, which is prepared by polymerizing or copolymerizing the following formula (I) compound:
- Wherein R is hydrogen or C1-C4 alkyl group;
- R′ is C1-C4 alkyl group;
- n is an integer of 2, 3, 4, 5 or 6, with vinyl monomers.
Dependencies are inferred from the claim text.