US 6,441,072 B1 · High-melting polyamide composition for electronic applications

Abstract

The invention relates to a polyamide composition for the production of electrical and electronic components that are suitable for the conditions of the surface mounting technology. In particular, the composition exhibits a high resistance to blistering during the reflow soldering process. The composition according to the invention comprises (a) a polyamide having a melting point higher than 280° C., (b) a polymer having a melting point lower than 230° C., (c) a halogen-containing compound, (d) optionally a synergist for the flame-retardant properties (e) reinforcing material (f) optionally other additives. A particularly good resistance to blistering is achieved if (f) contains at least a compound with acid imide groups.

Claims17

Dependent claims

Polyamide composition comprising

a. 20-60 wt. % of a polyamide having a melting point of at least about 280° C.,
b. 1-20 wt. % of a thermoplastic polymer having a melting point of lower than 230° C., chosen from the group formed by polyesters, copolyesters and polyamides.
c. 5-30 wt. % of a halogen-containing organic compound which, when heated at 300° C. for 10 minutes, generates at most 200 ppm, inorganic chlorine and at most 350 ppm,
d. 0-15 wt. % of a compound supporting the flame-retarding activity of (c),
e. 5-50 wt. % of an inorganic reinforcement,
f. 0-2-wt. % of other additives. and in which the sum of (a) to (f) adds up to 100 wt. %.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

09/654,472Filed 1 Sep 2000 · continuation

Priority

NL 10084432 Mar 1998

Granted

27 Aug 2002

Term ends

Not estimatedThe source records don’t support an estimate.

Classification9 codes

H10W 99/00
Subject matter not provided for in other groups of this subclass
C08K 5/03
Halogenated hydrocarbons: aromatic , e.g. C6H5-CH2-Cl
C08L 77/00
Compositions of polyamides obtained by reactions forming a carboxylic amide link in
C08L 77/06
Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain ; Compositions of derivatives of such polymers:…

High-melting polyamide composition for electronic applications

Life of this patent

High-melting polyamide composition for electronic applications

Life of this patent

Abstract

Claims17