Back to results
US 6,440,862 B1Granted
Stepped photoresist profile and opening formed using the profile
AssigneeMicron Technology, Inc.
InventorsShubneesh Batra, Christophe Pierrat
Life of this patent
Estimating the term…
Abstract
Stepped photoresist profiles provide various methods of forming profiles in an underlying substrate. The stepped photoresist profiles are formed in two layers of photoresist that are disposed over the substrate. The substrate is then etched twice using a respective opening in each photoresist layer to create a stepped profile in the substrate.
Claims8
A method of forming a hole in a substrate, the method comprising the acts of:
- (a) forming a lower layer of photoresist over the substrate;
- (b) forming an upper layer of photoresist over the lower layer of photoresist;
- (c) exposing the lower layer of photoresist and the upper layer of photoresist using a single photomask;
- (d) forming a first opening in the upper layer of photoresist and forming a second opening in the lower layer of photoresist using a single development step;
- (e) etching a first portion of the substrate through the first opening and the second opening to form a first hole in the substrate having a first width;
- and
- (f) etching a second portion of the substrate through at least the second opening to form a second hole in the substrate having a second width, the second width being greater than the first width.
4 more elements
A method of forming a hole in a substrate, the method comprising the acts of:
- (a) forming a lower layer of photoresist over the substrate;
- (b) forming an upper layer of photoresist over the lower layer of photoresist;
- (c) exposing the upper layer of photoresist using a first photomask;
- (d) exposing the lower layer of photoresist using a second photomask different from the first photomask;
- (e) etching a first portion of the substrate through the first opening and the second opening to form a first hole in the substrate having a first width;
- and
- (f) etching a second portion of the substrate through at least the second opening to form a second hole in the substrate having a second width, the second width being greater than the first width.
4 more elements
A method of forming a hole in a substrate, the method comprising the acts of:
- (a) forming a lower layer of photoresist over the substrate;
- (b) forming an upper layer of photoresist over the lower layer of photoresist;
- (c) forming a first opening in the upper layer of photoresist;
- (d) forming a second opening in the lower layer of photoresist;
- and
- (e) etching a first portion of the substrate through the first opening and the second opening to form a first hole in the substrate wherein the etching is performed by a single etchant.
3 more elements
Dependencies are inferred from the claim text.