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US 6,440,854 B1Granted
Anti-agglomeration of copper seed layers in integrated circuit metalization
AssigneeNovellus Systems, Inc.
InventorRobert T. Rozbicki
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Abstract
The present invention pertains to systems and methods for reducing the agglomeration of copper deposited by physical vapor deposition. More specifically, the invention pertains to systems and methods for depositing copper seed layers on a semiconductor wafer. The invention involves the use of an anti-agglomeration agent, so that the copper deposition is completed in an even, continuous and conformal manner.
Claims10
A method of physical vapor deposition of copper to form part or all of a seed layer on an integrated circuit substrate surface, the method comprising:
- physical vapor deposition of copper onto the substrate surface to form the copper seed layer;
- and
- applying an anti-agglomeration agent to incorporate the agent into the seed layer so that agglomeration of the seed layer is reduced.
Dependencies are inferred from the claim text.