Method of connecting a conductive trace to a semiconductor chip

A method of connecting a conductive trace to a semiconductor chip, comprising:

• providing a semiconductor chip that includes a conductive pad;
• attaching a conductive trace to a base, wherein the conductive trace includes a through-hole, and the conductive trace and the base are different materials;
• then
• disposing an adhesive between the chip and the conductive trace, thereby mechanically attaching the chip to the conductive trace such that the pad is aligned with the through-hole and the adhesive covers the pad;
• then
• removing some or all of the base, thereby exposing the through-hole;
• then
• forming an opening in the adhesive below the through-hole;
• exposing the pad through the opening and the through-hole;
• and then
• forming a connection joint in the through-hole that extends through the opening and electrically connects the conductive trace and the pad.

A method of connecting a conductive trace to a semiconductor chip, comprising the following steps in the sequence set forth:

• forming a conductive trace on a base, wherein the conductive trace and the base are different materials;
• disposing an insulative adhesive between a chip and the conductive trace, thereby mechanically attaching the chip to the conductive trace, wherein the chip includes upper and lower surfaces, the upper surface includes a pad, the conductive trace includes top and bottom surfaces and a through-hole therebetween, the adhesive contacts the upper and bottom surfaces, and the through-hole is aligned with the pad;
• applying an etch to the base that is selective of the base with respect to the conductive trace and the adhesive, thereby exposing the through-hole;
• applying an etch to the adhesive that removes any of the adhesive in the through-hole and forms an opening in the adhesive directly below the through-hole, thereby exposing the pad through the through-hole and the opening;
• and
• forming a connection joint inside the through-hole and the opening that contacts and electrically connects the conductive trace and the pad.

A method of connecting a conductive trace to a semiconductor chip, comprising the following steps in the sequence set forth:

• providing a metal layer base;
• providing a plating mask on the base, wherein the plating mask includes an opening that exposes a portion of the base;
• electroplating a conductive trace on the exposed portion of the base through the opening in the plating mask, wherein the conductive trace includes top and bottom surfaces and a through-hole therebetween, the top surface contacts the base, and the bottom surface is exposed;
• removing the plating mask, thereby exposing outer edges of the conductive trace between the top and bottom surfaces and sidewalls of the through-hole;
• mechanically attaching a chip to the conductive trace without contacting the chip to the conductive trace using an insulative adhesive, wherein the chip includes upper and lower surfaces, the upper surface includes a pad, the through-hole is aligned with the pad, and the adhesive contacts the upper and bottom surfaces;
• applying an etch that is selective of the base with respect to the conductive trace and the adhesive, thereby removing the base and exposing the top surface and the through-hole;
• applying an etch that is selective of the adhesive with respect to the conductive trace and the pad, thereby removing the adhesive in the through-hole and forming an opening in the adhesive beneath the through-hole and exposing the pad through the opening in the adhesive and the through-hole;
• and
• forming a connection joint in the through-hole that extends through the opening in the adhesive and contacts and electrically connects the conductive trace and the pad.

A method of connecting a conductive trace to a semiconductor chip, comprising the following steps in the sequence set forth:

• providing a metal layer base;
• providing a plating mask on the base, wherein the plating mask includes an opening that exposes a portion of the base;
• electroplating a conductive trace on the exposed portion of the base through the opening in the plating mask, wherein the conductive trace includes top and bottom surfaces and a through-hole therebetween, the top surface contacts the base, and the bottom surface is exposed;
• removing the plating mask, thereby exposing outer edges of the conductive trace between the top and bottom surfaces and sidewalls of the through-hole;
• mechanically attaching a chip to the conductive trace without contacting the chip to the conductive trace using an insulative adhesive, wherein the chip includes upper and lower surfaces, the upper surface includes a pad, the through-hole is aligned with the pad, and the adhesive contacts the upper and bottom surfaces;
• applying an etch that is selective of the base with respect to the conductive trace and the adhesive, thereby removing a portion of the base above the through-hole and exposing the through-hole and forming a pillar in the base outside the through-hole that covers and is connected to a portion of the conductive trace;
• applying an etch that is selective of the adhesive with respect to the conductive trace and the pad, thereby removing the adhesive in the through-hole and forming an opening in the adhesive beneath the through-hole and exposing the pad through the opening in the adhesive and the through-hole;
• and
• forming a connection joint in the through-hole that extends through the opening in the adhesive and contacts and electrically connects the conductive trace and the pad.

A method of connecting a conductive trace to a semiconductor chip, comprising the following steps in the sequence set forth:

• providing an adhesive between and in contact with a chip and a conductive trace, wherein the chip includes a pad, the conductive trace includes a through-hole, the pad is aligned with the through-hole, a base contacts and covers a top surface of the conductive trace opposite the chip and covers the through-hole, and the base and the conductive trace are different metallic materials;
• removing at least a portion of the base from the conductive trace, thereby exposing the through-hole;
• positioning a capillary with a wire ball extending therefrom over the through-hole, wherein the wire ball is connected to a wire that is fed through the capillary;
• moving the capillary towards the through-hole so that the wire ball enters the through-hole and contacts a contact region of the conductive trace and the pad;
• moving the capillary further towards the through-hole so that the wire ball deforms into a ball bond that substantially fills the through-hole and remains connected to the wire;
• and
• moving the capillary away from the through-hole, disconnecting the ball bond from the wire, and cooling the ball bond so that the ball bond forms a ball bond connection joint that is inside the through-hole and contacts and electrically connects the contact region of the conductive trace and the pad.