Optical semiconductor element package and manufacturing method thereof

A method for manufacturing an optical semiconductor element package which comprises:

• a housing including a metal frame and a metal bottom plate and configured to store optical semiconductor elements;
• electric signal input and output wiring boards arranged in said housing at positions at which the optical semiconductor elements do not exist right above and right below the boards;
• external leads drawn to an outside through a side wall of the metal frame;
• the wiring boards being connected to the external leads and to the optical semiconductor elements by bonding wires, an electric signal between the outside and the optical semiconductor elements being input and output through the bonding wires, said wiring boards and said external leads;
• said wiring boards having a top surface and an under surface and including first electrodes on the top surface and second electrodes on the under surface, said first electrodes being wire bonded to the optical semiconductor elements, said second electrodes being bonded to said external leads;
• and
• spacers being arranged between said metal bottom plate of the housing and said wiring boards,
• said method comprising:
• forming the spacers integrally with said metal frame or said metal bottom plate by metal injection molding.

A method for manufacturing an optical semiconductor element package which comprises:

• a housing including a metal frame and a metal bottom plate and configured to store optical semiconductor elements;
• electric signal input and output wiring boards arranged in said housing at positions at which the optical semiconductor elements do not exist right above and right below the boards;
• external leads drawn to an outside through a side wall of the metal frame;
• the wiring boards being connected to the external leads and to the optical semiconductor elements by bonding wires, and an electric signal between the outside and the optical semiconductor elements being input and output through the bonding wires, said wiring boards and said external leads;
• said wiring boards having a top surface and an under surface and include first electrodes on the top surface and second electrodes on the under surface, said first electrodes being wire bonded to the optical semiconductor elements, said second electrodes being bonded to said external leads;
• and
• spacers being arranged between said metal bottom plate of the housing and said wiring boards, said wiring boards being made of a glass ceramic material,
• said method comprising:
• forming the spacers integrally with said metal frame or said metal bottom plate by metal injection molding.