Method of depositing a thermoplastic polymer in semiconductor fabrication
AssigneeMicron Technology, Inc.
InventorsChad A. Cobbley, Tongbi Jiang, John Vannortwick
Life of this patent
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Abstract
A method of applying a dispersion (which may be in the form of a paste) of particles of a thermoplastic polymer in a liquid medium (i.e., liquid carrier) onto semiconductor wafers, dies, lead frames, and printed circuit boards, for example, to form bonding layers, pads, and bumps, etc.
Claims24
A method of applying a thermoplastic polymer to a semiconductor component comprising:
- providing a dispersion comprising thermoplastic particles and a liquid medium;
- applying the dispersion on the surface of the semiconductor component;
- and
- removing the liquid medium.
A method of applying a thermoplastic polymer to a leadframe, the leadframe comprising lead fingers, the method comprising:
- applying a thermoplastic dispersion comprising thermoplastic particles and a liquid medium to the lead fingers;
- and
- removing the liquid medium.
A method of attaching a die to a leadframe, the leadframe comprising lead fingers, the method comprising:
- applying a thermoplastic dispersion comprising thermoplastic particles and a liquid medium to the lead fingers;
- removing the liquid medium;
- heating the thermoplastic particles to form a thermoplastic bonding layer;
- and
- placing a die against the bonding layer, thereby attaching the die to the leadframe.
A method of applying a thermoplastic polymer to a printed circuit board, the method comprising:
- applying a thermoplastic dispersion comprising thermoplastic particles and a liquid medium in a predetermined pattern to a printed circuit board;
- and
- removing the liquid medium.
A method of attaching a die to a printed circuit board, the method comprising:
- applying a thermoplastic dispersion comprising thermoplastic particles and a liquid medium in a predetermined pattern to a printed circuit board to produce an area to accept a die;
- removing the liquid medium;
- heating the thermoplastic particles to form a thermoplastic bonding layer;
- and
- placing the die against the bonding layer thereby attaching the die to the printed circuit board.
A method of sealing a flip chip on a printed circuit board, the flip chip comprising a plurality of conductive bumps, said method comprising:
- placing a flip chip on a printed circuit board, thus forming voids;
- applying a thermoplastic dispersion comprising thermoplastic particles and a liquid medium to the voids;
- removing the liquid medium;
- and
- heating the thermoplastic particles to form a thermoplastic underfill material thereby sealing the flip chip to the printed circuit board.
A method of applying a thermoplastic polymer to a flip chip, the flip chip comprising a plurality of conductive bumps and spaces between the bumps, the method comprising:
- applying a thermoplastic dispersion comprising thermoplastic particles and a liquid medium in the spaces between the bumps;
- and
- removing the liquid medium.
A method of making thermoplastic bump dams on a flip chip, the flip chip comprising a plurality of conductive bumps and spaces between the bumps, the method comprising:
- applying a thermoplastic dispersion comprising thermoplastic particles and a liquid medium in the spaces between the bumps;
- removing the liquid medium;
- and
- heating the thermoplastic particles to form thermoplastic bump dams.
A method of making an array, the array comprising a plurality of conductive thermoplastic deposits on the surface of a molded body of an integrated circuit package, the method comprising:
- applying a thermoplastic dispersion comprising thermoplastic particles and a liquid medium to form deposits;
- removing the liquid medium;
- and
- heating the thermoplastic particles to form conductive thermoplastic deposits.
A method of applying a thermoplastic polymer to a semiconductor component comprising:
- providing a dispersion comprising thermoplastic particles and a liquid medium wherein the thermoplastic particles are less than about 250 microns in diameter;
- applying the dispersion on the surface of the semiconductor component;
- and
- removing the liquid medium.
A method of applying a thermoplastic polymer to a semiconductor component comprising:
- providing a dispersion comprising thermoplastic particles and a liquid medium;
- coating the dispersion on the surface of the semiconductor component;
- and
- removing the liquid medium.
Dependencies are inferred from the claim text.