Electronic device, method of manufacturing the same, and apparatus for manufacturing the same

An apparatus for manufacturing an electronic device, comprising:

• a plunger for pressurizing thermosetting resin for transfer molding;
• a runner in which the thermosetting resin for transfer molding flows;
• a cavity into which the thermosetting resin for transfer molding flows, which communicates with the runner;
• and
• a mold for transfer molding including an upper mold and a lower mold that define the cavity,
• wherein a ceramic substrate provided with a metallic thin film integrated into at least one selected from an upper surface and a lower surface of the ceramic substrate in its peripheral portion is placed so as to extend both inside and outside the cavity of the mold for transfer molding, and the metallic thin film is positioned in a portion with which the upper mold and the lower mold of the mold come into contact;
• and
• the thermosetting resin for transfer molding is injected into the cavity, is molded, and is cured by heating.