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US 6,440,773 B1Granted
Semiconductor device
AssigneeHitachi, Ltd.
InventorMitsuo Usami
Life of this patent
Estimating the term…
Abstract
An IC card strong against bending and with a thin semiconductor chip mounted thereon is disclosed which is further provided with a reinforcing plate to reduce damage of the semiconductor chip caused by a point pressure. The IC card is employable even under a mechanically severe environment and is thus highly reliable.
Claims24
A method for manufacturing card-like semiconductor devices, comprising the steps of:
- providing a semiconductor wafer having a plurality of ICs formed thereon;
- removing the back side of the semiconductor wafer to thin the wafer into a thickness of 0.1 to 110 μm;
- affixing a metallic plate as a reinforcing plate to the back of the thus-thinned semiconductor wafer to reduce a local stress of each of the ICs;
- cutting the semiconductor wafer into a plurality of IC chips with the metallic plate affixed thereto to form a plurality of laminates each comprised of a piece of the metallic plate and one of the IC chips;
- and
- mounting the laminate onto a card-like substrate.
3 more elements
A method for manufacturing card-like semiconductor devices, comprising the steps of:
- providing a semiconductor wafer with a plurality of ICs formed thereon;
- removing the back side of the semiconductor wafer to thin the wafer into a thickness of 0.1 to 110 μm;
- cutting the semiconductor wafer to form a plurality of IC chips;
- providing a plurality of thin substrates with a conductive pattern formed thereon;
- opposing each of the cut IC chips to a corresponding one of the thin substrates and connecting an external terminal formed on one side of each of the IC chips to the conductive pattern of the corresponding one of the thin substrates;
- attaching a reinforcing plate for reducing a local stress imposed on each IC chip to an opposite side of each IC chip;
- and
- forming cover sheets so as to sandwich therebetween each IC chip with the reinforcing plate attached thereto.
5 more elements
Dependencies are inferred from the claim text.