Method for constructing a wafer interposer by using conductive columns
AssigneeEaglestone Partners I, LLC
InventorJohn L. Pierce
Life of this patent
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Abstract
The present invention provides a method and apparatus for testing wafers that is simple and allows testing prior to dicing so that the need to temporarily package individual dies for testing is eliminated. As a result, the number of manufacturing steps is reduced, thus increasing first pass yields. In addition, manufacturing time is decreased, thereby improving cycle times and avoiding additional costs. The invention also provides for packaging of the die at the completion of testing. One form of the present invention provides an interposer substrate connected to a wafer through conductive columns.
Claims24
An interposer assembly comprising:
- a substrate having an upper surface and a lower surface, one or more first electrical contacts on the lower surface, one or more second electrical contacts on the upper surface, one or more electrical pathways passing through the substrate, and connecting the first electrical contacts to the second electrical contacts;
- a wafer including one or more dies, and having an upper surface and a lower surface, one or more third electrical contacts on the upper surface of the wafer, the third electrical contacts being associated with the dies;
- a conductive column electrically connecting each first electrical contact with a corresponding third electrical contact;
- and
- a layer of no-flow underfill disposed between the upper surface of the wafer and the lower surface of the substrate.
A method for producing an interposer assembly comprising the steps of:
- attaching one or more first electrical contacts to a lower surface of a substrate;
- attaching one or more second electrical contacts to an upper surface of the substrate;
- creating one or more electrical pathways passing through the substrate and connecting the first electrical contacts to the second electrical contacts;
- depositing a conductive column and a no-flow underfill and bonding the substrate to a wafer such that the conductive column and the no-flow underfill form an adhesive bond between the lower surface substrate and the wafer.
Dependencies are inferred from the claim text.