Microelectronic fabrication die electrical probe apparatus electrical test method providing enhanced microelectronic fabrication die electrical test accuracy and efficiency
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorFeng-Yi Yang
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Abstract
Within a method for electrical test testing a series of microelectronic fabrication die fabricated within a microelectronic fabrication substrate, there is first electrical probe tested the series of microelectronic fabrication die to determine at least one sub-series of electrically unacceptable microelectronic fabrication die. Each electrically unacceptable microelectronic fabrication die within the series of electrically unacceptable microelectronic fabrication die is then electrical probe retested after having repositioned an electrical probe head with respect to the electrically unacceptable microelectronic fabrication die.
Claims15
A method for electrically testing a series of microelectronic fabrication die fabricated within a microelectronic fabrication substrate comprising:
- providing a microelectronic fabrication substrate having fabricated therein a series of microelectronic fabrication die;
- electrically testing within the microelectronic fabrication substrate the series of microelectronic fabrication die while employing an electrical probe apparatus which sequentially repositions an electrical probe head which accommodates at least one microelectronic fabrication die within the series of microelectronic fabrication die when electrically testing each of the microelectronic fabrication die within the series of microelectronic fabrication die to thus determine from the series of microelectronic fabrication die at least one sub-series of electrically unacceptable microelectronic fabrication die;
- and
- electrically retesting the at least one sub-series of electrically unacceptable microelectronic fabrication die after having repositioned the electrical probe head with respect to each microelectronic fabrication die within the at least one sub-series of electrically unacceptable microelectronic fabrication die.
A method for electrically testing a series of semiconductor integrated circuit microelectronic fabrication die fabricated within a semiconductor integrated circuit microelectronic fabrication substrate wafer comprising:
- providing a semiconductor integrated circuit microelectronic fabrication substrate wafer having fabricated therein a series of semiconductor integrated circuit microelectronic fabrication die;
- electrically testing within the semiconductor integrated circuit microelectronic fabrication substrate wafer the series of semiconductor integrated circuit microelectronic fabrication die while employing an electrical probe apparatus which sequentially repositions an electrical probe head which accommodates at least one semiconductor integrated circuit microelectronic fabrication die within the series of semiconductor integrated circuit microelectronic fabrication die when electrically testing each of the semiconductor integrated circuit microelectronic fabrication die within the series of semiconductor integrated circuit microelectronic fabrication die to thus determine from the series of semiconductor integrated circuit microelectronic fabrication die at least one sub-series of electrically unacceptable semiconductor integrated circuit microelectronic fabrication die;
- and
- electrically retesting the at least one sub-series of electrically unacceptable semiconductor integrated circuit microelectronic fabrication die after having repositioned the electrical probe head with respect to each semiconductor integrated circuit microelectronic fabrication die within the at least one sub-series of electrically unacceptable semiconductor integrated circuit microelectronic fabrication die.
Dependencies are inferred from the claim text.