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AssigneeNGK Insulators, Ltd.
InventorsMasayuki Shinkai, Masahiro Kida
Estimating the term…
An adhesive composition is provided for bonding two or more different members which can give a bonded material having excellent heat resistance characteristics while inhibiting breakage of the materials to be bonded by reducing the expansion coefficient, the Young's modulus and the proof stress value. A method for bonding two or more different members using the adhesive composition, and a composite member comprising two or more different members bonded by the above method can be provided by the adhesive composition which comprises a hard solder and a mixture of at least two fine particle materials differing in wettability with the hard solder and which is controlled in expansion coefficient, Young's modulus and proof stress value.
A composite member comprising at least a first member having a dented portion which forms a fitting structure and at least a second member having a protruded portion which forms a fitting structure and being different from said first member having the dented portion, said different first and second members being fitted to each other and bonded with a bonding layer comprising a hard solder and a mixture of at least two fine particle materials differing in wettability with said hard solder.
Dependencies are inferred from the claim text.